{"title":"一种全差分、多路传感接口电路与三轴纯氧化物电容式CMOS-MEMS加速度计单片集成","authors":"Yu-Chia Liu, M. Tsai, Sheng-Shian Li, W. Fang","doi":"10.1109/TRANSDUCERS.2013.6626840","DOIUrl":null,"url":null,"abstract":"The integration of a CMOS multi-channel readout circuit and tri-axis capacitive accelerometers on a single chip has been demonstrated in this work. The tri-axis mechanical structure together with the monolithic tri-axis multiplexed accelerometer interface circuit is proposed and demonstrated for the first time. Such a system exhibits the following features: (1) the smallest chip size is realized by a timing-based readout circuit; (2) the signal-to-noise ratio (SNR) is enhanced by a fully differential sensing mechanism; and (3) the stacking of the pure oxide layers, serving as the mechanical structures, enhances temperature stability. As a result, the sensing system not only reduces the total chip size but significantly improves the overall system performance.","PeriodicalId":202479,"journal":{"name":"2013 Transducers & Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII)","volume":"116 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2013-06-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":"{\"title\":\"A fully-differential, multiplex-sensing interface circuit monolithically integrated with tri-axis pure oxide capacitive CMOS-MEMS accelerometers\",\"authors\":\"Yu-Chia Liu, M. Tsai, Sheng-Shian Li, W. Fang\",\"doi\":\"10.1109/TRANSDUCERS.2013.6626840\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The integration of a CMOS multi-channel readout circuit and tri-axis capacitive accelerometers on a single chip has been demonstrated in this work. The tri-axis mechanical structure together with the monolithic tri-axis multiplexed accelerometer interface circuit is proposed and demonstrated for the first time. Such a system exhibits the following features: (1) the smallest chip size is realized by a timing-based readout circuit; (2) the signal-to-noise ratio (SNR) is enhanced by a fully differential sensing mechanism; and (3) the stacking of the pure oxide layers, serving as the mechanical structures, enhances temperature stability. As a result, the sensing system not only reduces the total chip size but significantly improves the overall system performance.\",\"PeriodicalId\":202479,\"journal\":{\"name\":\"2013 Transducers & Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII)\",\"volume\":\"116 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2013-06-16\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"5\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2013 Transducers & Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/TRANSDUCERS.2013.6626840\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2013 Transducers & Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/TRANSDUCERS.2013.6626840","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A fully-differential, multiplex-sensing interface circuit monolithically integrated with tri-axis pure oxide capacitive CMOS-MEMS accelerometers
The integration of a CMOS multi-channel readout circuit and tri-axis capacitive accelerometers on a single chip has been demonstrated in this work. The tri-axis mechanical structure together with the monolithic tri-axis multiplexed accelerometer interface circuit is proposed and demonstrated for the first time. Such a system exhibits the following features: (1) the smallest chip size is realized by a timing-based readout circuit; (2) the signal-to-noise ratio (SNR) is enhanced by a fully differential sensing mechanism; and (3) the stacking of the pure oxide layers, serving as the mechanical structures, enhances temperature stability. As a result, the sensing system not only reduces the total chip size but significantly improves the overall system performance.