P. Knebel, Dan Berkram, A. Davis, Darel N. Emmot, P. Faraboschi, G. Gostin
{"title":"用于百亿亿次结构的Gen-Z芯片组","authors":"P. Knebel, Dan Berkram, A. Davis, Darel N. Emmot, P. Faraboschi, G. Gostin","doi":"10.1109/HOTCHIPS.2019.8875646","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":273415,"journal":{"name":"2019 IEEE Hot Chips 31 Symposium (HCS)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"7","resultStr":"{\"title\":\"Gen-Z Chipsetfor Exascale Fabrics\",\"authors\":\"P. Knebel, Dan Berkram, A. Davis, Darel N. Emmot, P. Faraboschi, G. Gostin\",\"doi\":\"10.1109/HOTCHIPS.2019.8875646\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\",\"PeriodicalId\":273415,\"journal\":{\"name\":\"2019 IEEE Hot Chips 31 Symposium (HCS)\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2019-08-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"7\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2019 IEEE Hot Chips 31 Symposium (HCS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/HOTCHIPS.2019.8875646\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 IEEE Hot Chips 31 Symposium (HCS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/HOTCHIPS.2019.8875646","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}