基于工况的机械可靠性试验发展的挑战与进展

Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003. Pub Date : 1900-01-01 DOI:10.1109/EPTC.2003.1298762

L. Mercado, S. Sahasrabudhe, E. Monroe

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引用次数: 0

摘要

随着电子封装技术的飞速发展，基于现场条件的可靠性测试已成为封装可靠性评估的必要手段。本文讨论了在装配和最终使用条件表征以及可靠性测试发展方面的一些主要挑战和最新进展。

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Challenges and advances in use-condition-based mechanical reliability test development

With rapid advances in the electronic packaging technology, reliability tests based on field conditions have become essential to the package reliability assessment. This paper discusses some major challenges and recent advances in both the assembly and end use condition characterizations and reliability test development.

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来源期刊

Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003.

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