一种不需要同步信号的故障分析软缺陷定位方法

2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits Pub Date : 2009-07-06 DOI:10.1109/IPFA.2009.5232662

Wu Chunlei, L. Zhai, M. Motohiko, Jonathon Liu, H. Ma, John Liu

{"title":"一种不需要同步信号的故障分析软缺陷定位方法","authors":"Wu Chunlei, L. Zhai, M. Motohiko, Jonathon Liu, H. Ma, John Liu","doi":"10.1109/IPFA.2009.5232662","DOIUrl":null,"url":null,"abstract":"Failure analysis on advanced logic and mixed signal ICs more and more has to deal with so called ‘soft defect’. In this paper, a novel method to realize Soft Defect Localization (SDL) techniques without a synchronization signal for failure analysis is presented. We will present experimental results showing the accuracy of this method in order to help failure analysis to localize defect in short time.","PeriodicalId":210619,"journal":{"name":"2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2009-07-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"8","resultStr":"{\"title\":\"A Novel Method to Realize Soft Defect Localization Techniques without a Synchronization Signal for Failure Analysis\",\"authors\":\"Wu Chunlei, L. Zhai, M. Motohiko, Jonathon Liu, H. Ma, John Liu\",\"doi\":\"10.1109/IPFA.2009.5232662\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Failure analysis on advanced logic and mixed signal ICs more and more has to deal with so called ‘soft defect’. In this paper, a novel method to realize Soft Defect Localization (SDL) techniques without a synchronization signal for failure analysis is presented. We will present experimental results showing the accuracy of this method in order to help failure analysis to localize defect in short time.\",\"PeriodicalId\":210619,\"journal\":{\"name\":\"2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2009-07-06\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"8\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IPFA.2009.5232662\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IPFA.2009.5232662","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 8

摘要

在高级逻辑和混合信号集成电路的故障分析中，越来越多地需要处理所谓的“软缺陷”。提出了一种无需同步信号即可实现软缺陷定位(SDL)的方法。我们将提供实验结果来证明该方法的准确性，以帮助故障分析在短时间内定位缺陷。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

A Novel Method to Realize Soft Defect Localization Techniques without a Synchronization Signal for Failure Analysis

Failure analysis on advanced logic and mixed signal ICs more and more has to deal with so called ‘soft defect’. In this paper, a novel method to realize Soft Defect Localization (SDL) techniques without a synchronization signal for failure analysis is presented. We will present experimental results showing the accuracy of this method in order to help failure analysis to localize defect in short time.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits

自引率

0.00%

发文量