陶瓷四平面封装和互连的热应力/应变分析

40th Conference Proceedings on Electronic Components and Technology Pub Date : 1990-05-20 DOI:10.1109/ECTC.1990.122285

J. Lau, D. Rice

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引用次数: 20

摘要

采用三维非线性有限元方法对表面贴装的细节距组件的热应力和热应变进行了弹塑性分析。这种细间距元件是EIAJ(日本电子工业协会)160引脚陶瓷四平面封装(CQFP)。为了比较的目的，EIAJ 160引脚塑料四平面封装(PQFP)也进行了分析。详细的应力和应变分布和引线框架和焊点的全场位移提供了更好的理解他们的机械行为在热循环。结果表明，CQFP焊点的应力和应变均大于PQFP焊点。本文的研究结果对这类表面贴装组件的可靠性设计有一定的参考价值。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Thermal stress/strain analysis of ceramic quad flat pack packages and interconnections

An elastoplastic analysis of the thermal stresses and strains in a surface-mount fine-pitch assembly using a 3-D nonlinear finite-element method is presented. This fine-pitch component is the EIAJ (Electronic Industry Associates of Japan) 160-pin ceramic quad flat pack (CQFP). For comparison purposes, the EIAJ 160-pin plastic quad flat pack (PQFP) was also analyzed. Detailed stress and strain distributions and whole-field displacements of the lead frame and solder joint are provided for a better understanding of their mechanical behavior during thermal cycling. It was found that the stresses and strains in the CQFP solder joint are larger than those in the PQFP. The results presented should be useful in the design for reliability of this class of surface-mount assemblies.<>

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来源期刊

40th Conference Proceedings on Electronic Components and Technology

CiteScore

3.10

自引率

0.00%

发文量