高速IO互连评价新指标

Se-jung Moon, E. Acar, R. Mellitz
{"title":"高速IO互连评价新指标","authors":"Se-jung Moon, E. Acar, R. Mellitz","doi":"10.1109/EPEPS.2011.6100192","DOIUrl":null,"url":null,"abstract":"This paper proposes new frequency-domain (FD) metrics to evaluate and optimize interconnects for high-speed IO. In this paper, we focused on a spring-probe socket for interconnects and PCIe Gen3 for the high-speed IO. For design optimization, we adapted a holistic approach utilizing response surface methodology. Using the proposed metrics, the spring-probe socket design was optimized to minimize impact on the IO channel performance. In order to check the validity of the new metrics, an optimized socket design via voltage margin and timing margin from eye opening was compared.","PeriodicalId":313560,"journal":{"name":"2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems","volume":"8 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2011-12-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"New interconnect evaluation metric for high-speed IO\",\"authors\":\"Se-jung Moon, E. Acar, R. Mellitz\",\"doi\":\"10.1109/EPEPS.2011.6100192\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper proposes new frequency-domain (FD) metrics to evaluate and optimize interconnects for high-speed IO. In this paper, we focused on a spring-probe socket for interconnects and PCIe Gen3 for the high-speed IO. For design optimization, we adapted a holistic approach utilizing response surface methodology. Using the proposed metrics, the spring-probe socket design was optimized to minimize impact on the IO channel performance. In order to check the validity of the new metrics, an optimized socket design via voltage margin and timing margin from eye opening was compared.\",\"PeriodicalId\":313560,\"journal\":{\"name\":\"2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems\",\"volume\":\"8 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2011-12-12\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPEPS.2011.6100192\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEPS.2011.6100192","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

摘要

本文提出了新的频域(FD)指标来评估和优化高速IO互连。在本文中,我们重点研究了用于互连的弹簧探针插座和用于高速IO的PCIe Gen3。为了优化设计,我们采用了一种利用响应面方法的整体方法。利用提出的指标,优化了弹簧探针插座设计,以最大限度地减少对IO通道性能的影响。为了验证新指标的有效性,比较了基于电压裕度和睁眼时间裕度的优化插座设计。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
New interconnect evaluation metric for high-speed IO
This paper proposes new frequency-domain (FD) metrics to evaluate and optimize interconnects for high-speed IO. In this paper, we focused on a spring-probe socket for interconnects and PCIe Gen3 for the high-speed IO. For design optimization, we adapted a holistic approach utilizing response surface methodology. Using the proposed metrics, the spring-probe socket design was optimized to minimize impact on the IO channel performance. In order to check the validity of the new metrics, an optimized socket design via voltage margin and timing margin from eye opening was compared.
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