数字VLSI电路串扰故障的分析与测试方法

A. Rubio, N. Itazaki, Xiaole Xu, K. Kinoshita
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引用次数: 3

摘要

集成电路中器件尺寸的不断减小和开关速率的不断提高会导致导电层之间的寄生电容占主导地位,从而引起电路中的逻辑错误。因此,电容耦合可视为潜在的逻辑故障。经典的断层模型没有涵盖这类断层。本文给出了这些故障的逻辑故障表征、逻辑级电路故障模型、工作在布局级的串扰故障列表发生器以及串扰型故障的测试图生成程序
本文章由计算机程序翻译,如有差异,请以英文原文为准。
An approach to the analysis and test of crosstalk faults in digital VLSI circuits
The continuous reduction of the device size in integrated circuits and the increasing of the switching rate cause parasitic capacitances between conducting layers which might become dominant enough to provoke logic errors in the circuits. So, capacitive couplings can be considered as potential logic faults. Classical fault models do not cover this sort of faults. This paper presents a logic fault characterization of these faults, a logic level circuit fault model, a crosstalk fault list generator working at layout level and a test pattern generation procedure for crosstalk type faults.<>
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