通过新型高性能使用点(POU)滤波器降低EUV电阻的缺陷

Yiren Zhang, T. Umeda, Hirokazu Sakakibara, S. A. U. Ibrahim, Atsushi Sakamoto, Amarnauth Singh, R. Shick, K. Skjonnemand, P. Foubert, Waut Drent
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引用次数: 0

摘要

用于极紫外(EUV)光刻化学品的滤光剂,如化学放大光刻胶(CAR),因其在大批量生产中去除聚集物质和减少微桥的能力而具有吸引力。与大流量循环模式中使用的散装过滤器不同,使用点(POU)过滤器采用单通道模式,因此保留性能和清洁度成为最关键的因素。之前的报告已经展示了通过使用最先进的HDPE膜过滤器Pall®sub-1nm HDPE (XPR3L)过滤EUV光阻来减少晶圆上缺陷的好处。在这项研究中,我们提出了一种新型的HDPE过滤器,专门设计用于提供高保留性能,这主要是通过改善膜的保留特性和成品POU过滤器的清洁度来实现的。该膜被设计成具有更细的孔径和更好的孔几何形状,以改善缺陷保留。为了加快过滤器启动过程,采用优化的设备清洗流程进一步提高初始清洁度,通过GC-MS、LC-MS/MS和ICP-MS等测量结果表明。最后,在TEL CleanTrack™LITHIUS Pro™-Z和ASML NXE:3400B组成的imec EUV簇上对POU滤波器进行了评估,并在16nm L/S的图像化晶圆上获得了比较缺陷数据。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Defectivity reduction in EUV resists through novel high-performance Point-Of-Use (POU) filters
Filters for Extreme Ultra-Violet (EUV) lithography chemicals, like chemically amplified photoresist (CAR), are attractive because of their capabilities to remove aggregated species and reduce microbridges in high volume manufacturing. Unlike bulk filters used in high-flow circulation mode, point-of-use (POU) filter is used in single-pass mode, so the retention performance and cleanliness become the most critical factors. Earlier presentations have demonstrated the benefit of reducing on-wafer defectivities through filtration of EUV photoresists with the state-of-the-art HDPE membranes filters, Pall® sub-1nm HDPE (XPR3L). In this study, we present a novel HDPE filter specifically designed to provide high retention performance, which is mainly enabled by an improvement in retention characteristics of membrane and cleanliness in finished POU filters. The membrane was designed to have a finer pore size and better pore geometry to improve defect retention. To expedite the filter start-up process, optimized device cleaning process was applied to further improve initial cleanliness, which was indicated by GC-MS, LC-MS/MS and ICP-MS measurements, etc. Finally, the POU filters were evaluated at imec EUV cluster consisting of TEL CleanTrack™ LITHIUS Pro™-Z and ASML NXE:3400B, and comparative defect data was obtained from patterned wafers with 16nm L/S.
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