硅纳米线阵列热电能量采集器

A. A. Tahrim, Anita Ahmad, Mohamed Sultan Mohamed Ali
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引用次数: 5

摘要

本研究旨在探讨硅纳米线阵列(SiNWAs)和块状硅材料作为热电收集器的性能。采用两步金属辅助化学蚀刻技术制备了SiNWAs。制备的1 × 1 cm p型和n型SiNWAs热电器件直径为70 ~ 100 nm,纳米线长度约为6 μm。体硅器件也作为SiNWAs热电器件的基准进行了测试。与大块硅器件相比,通过SiNWAs器件的热流在热结和冷结之间表现出更高的温差ΔT。这表明,由于纳米线的存在,硅的热容量C显著降低。因此,C的减少也降低了硅的导热性,这有利于良好的热电材料。与块体硅相比,SiNWAs热电器件还具有更高的塞贝克电压,Voc和塞贝克系数s,电压随着两个结之间ΔT的增加而升高。增加SiNWAs热电器件中Voc和S的含量有助于提高热电器件的品质系数和效率。实验表征表明,p-SiNWAs器件在40秒时温度最高ΔT为17°C;Voc = ~ 35mv, S = ~ 8mv /K。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Silicon nanowire arrays thermoelectric power harvester
This study aims to investigate the performance of Silicon Nanowire Arrays (SiNWAs) and bulk Si material as thermoelectric power harvesters. SiNWAs were developed using a two-step metal-assisted chemical etching technique. The fabricated thermoelectric devices of 1 × 1 cm p- and n-type SiNWAs each have a diameter of 70–100 nm, and an approximate nanowire length of 6 μm. Bulk Si devices were also tested as a benchmark for the SiNWAs thermoelectric devices. The heat flow across the SiNWAs devices exhibits a higher temperature difference, ΔT, between hot and cold junctions, compared to bulk silicon devices. This reveals that the heat capacity, C, of silicon is reduced significantly by the presence of nanowires. Consequently, a reduction in C also reduces the thermal conductivity of silicon, which is favourable for a good thermoelectric material. Compared to bulk silicon, SiNWAs thermoelectric devices also demonstrate higher Seebeck voltage, Voc, and Seebeck coefficient, S. The voltage rises as the ΔT between two junctions increases. An increase in Voc and S in the SiNWAs thermoelectric device aids to improve the figure-of-merit and the efficiency of the thermoelectric device. Experimental characterization of all fabricated thermoelectric devices suggest that the p-SiNWAs device possesses the highest ΔT of 17°C at 40 sec; Voc = ∼35 mV and S = ∼8 mV/K.
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