先进的CMOS技术:Ge, SiGe, Si:C和基于Si的器件的S&D盐化

V. Carron
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引用次数: 0

摘要

-应变和锗基材料对CMOS技术的增强有很大的兴趣-然而,它们作为通道和/或S&D材料的引入对Salicide工艺产生了强烈的影响,需要进行调整,以保持这些新材料所带来的预期效益-实际上,与这些先进材料的硅化(锗化)相关的新问题已经出现,其中大多数已经解决(例如:除了应变材料和锗基材料外,硅化/锗化接触材料本身的选择,以及相关的水化物工艺,是进一步提高性能的关键领域(界面工程、双硅化方法……)
本文章由计算机程序翻译,如有差异,请以英文原文为准。
S&D salicidation for advanced CMOS technology: Ge, SiGe, Si:C, and sSibased devices
▪ Strained and Ge-based materials have great interests for CMOS technology enhancement ▪ However, their introduction as channel and/or S&D materials has a strong impact on the Salicide process which needs adaptations in order to keep the expected benefit induced by these new materials ▪ Indeed, new issues related to the silicidation (germanidation) of these advanced materials have emerged and most of them have been solved (exemple : Ge lateral diffusion) ▪ In addition to strained and Ge-based materials, the choice of the silicide/germanide contact material in itself, as well as the associated salicide process, are key areas for further performance enhancement (interface engineering, dual silicide approach…)
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