{"title":"先进的CMOS技术:Ge, SiGe, Si:C和基于Si的器件的S&D盐化","authors":"V. Carron","doi":"10.1109/RTP.2008.4690533","DOIUrl":null,"url":null,"abstract":"▪ Strained and Ge-based materials have great interests for CMOS technology enhancement ▪ However, their introduction as channel and/or S&D materials has a strong impact on the Salicide process which needs adaptations in order to keep the expected benefit induced by these new materials ▪ Indeed, new issues related to the silicidation (germanidation) of these advanced materials have emerged and most of them have been solved (exemple : Ge lateral diffusion) ▪ In addition to strained and Ge-based materials, the choice of the silicide/germanide contact material in itself, as well as the associated salicide process, are key areas for further performance enhancement (interface engineering, dual silicide approach…)","PeriodicalId":317927,"journal":{"name":"2008 16th IEEE International Conference on Advanced Thermal Processing of Semiconductors","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2008-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"S&D salicidation for advanced CMOS technology: Ge, SiGe, Si:C, and sSibased devices\",\"authors\":\"V. Carron\",\"doi\":\"10.1109/RTP.2008.4690533\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"▪ Strained and Ge-based materials have great interests for CMOS technology enhancement ▪ However, their introduction as channel and/or S&D materials has a strong impact on the Salicide process which needs adaptations in order to keep the expected benefit induced by these new materials ▪ Indeed, new issues related to the silicidation (germanidation) of these advanced materials have emerged and most of them have been solved (exemple : Ge lateral diffusion) ▪ In addition to strained and Ge-based materials, the choice of the silicide/germanide contact material in itself, as well as the associated salicide process, are key areas for further performance enhancement (interface engineering, dual silicide approach…)\",\"PeriodicalId\":317927,\"journal\":{\"name\":\"2008 16th IEEE International Conference on Advanced Thermal Processing of Semiconductors\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2008-09-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2008 16th IEEE International Conference on Advanced Thermal Processing of Semiconductors\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/RTP.2008.4690533\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2008 16th IEEE International Conference on Advanced Thermal Processing of Semiconductors","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/RTP.2008.4690533","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
S&D salicidation for advanced CMOS technology: Ge, SiGe, Si:C, and sSibased devices
▪ Strained and Ge-based materials have great interests for CMOS technology enhancement ▪ However, their introduction as channel and/or S&D materials has a strong impact on the Salicide process which needs adaptations in order to keep the expected benefit induced by these new materials ▪ Indeed, new issues related to the silicidation (germanidation) of these advanced materials have emerged and most of them have been solved (exemple : Ge lateral diffusion) ▪ In addition to strained and Ge-based materials, the choice of the silicide/germanide contact material in itself, as well as the associated salicide process, are key areas for further performance enhancement (interface engineering, dual silicide approach…)