用多导体传输线理论分析配电网

2007 IEEE Electrical Performance of Electronic Packaging Pub Date : 2007-11-21 DOI:10.1109/EPEP.2007.4387179

K. Payandehjoo, D. Kostka, R. Abhari

{"title":"用多导体传输线理论分析配电网","authors":"K. Payandehjoo, D. Kostka, R. Abhari","doi":"10.1109/EPEP.2007.4387179","DOIUrl":null,"url":null,"abstract":"Multiconductor transmission line theory (MTL) is employed in modeling of multilayer power distribution networks. This approach is utilized to predict the impedance profile of a mesh-based PDN at various port locations and results are verified by IBM's EIP tool. EIP is also employed to predict the current distribution on the grid and to simplify the MTL model.","PeriodicalId":402571,"journal":{"name":"2007 IEEE Electrical Performance of Electronic Packaging","volume":"8 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2007-11-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"Analysis of Power Distribution Networks using Multiconductor Transmission Line Theory\",\"authors\":\"K. Payandehjoo, D. Kostka, R. Abhari\",\"doi\":\"10.1109/EPEP.2007.4387179\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Multiconductor transmission line theory (MTL) is employed in modeling of multilayer power distribution networks. This approach is utilized to predict the impedance profile of a mesh-based PDN at various port locations and results are verified by IBM's EIP tool. EIP is also employed to predict the current distribution on the grid and to simplify the MTL model.\",\"PeriodicalId\":402571,\"journal\":{\"name\":\"2007 IEEE Electrical Performance of Electronic Packaging\",\"volume\":\"8 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2007-11-21\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2007 IEEE Electrical Performance of Electronic Packaging\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPEP.2007.4387179\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2007 IEEE Electrical Performance of Electronic Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEP.2007.4387179","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 4

摘要

采用多导体传输线理论对多层配电网进行建模。该方法用于预测基于网格的PDN在不同端口位置的阻抗分布，并通过IBM的EIP工具验证了结果。EIP还用于预测电网上的电流分布，简化MTL模型。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

Analysis of Power Distribution Networks using Multiconductor Transmission Line Theory

Multiconductor transmission line theory (MTL) is employed in modeling of multilayer power distribution networks. This approach is utilized to predict the impedance profile of a mesh-based PDN at various port locations and results are verified by IBM's EIP tool. EIP is also employed to predict the current distribution on the grid and to simplify the MTL model.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

2007 IEEE Electrical Performance of Electronic Packaging

自引率

0.00%

发文量