钝化单壁碳纳米管晶体管的直流和闪烁噪声模型

Lin Yu, Sunkook Kim, S. Mohammadi
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Source and drain contacts separated by 3µm are formed by electron beam deposition of Pd metal. A 20nm high-k HfO<inf>2</inf> film is deposited using ASM Micro-chemistry F-120 ALCVD<sup>™</sup> Reactor at 300°C by using precursor of HfCl<inf>4</inf> and H<inf>2</inf>O. Top Gate metal is defined by UV photolithography followed by the deposition of Cr/Au (10/50nm) with a minimum gate length of 1.5 µm. Cr/Au (20/450nm) metal interconnects are finally deposited on top of the source and drain Pd contacts. Fig. 2 shows transfer characteristics (I<inf>d</inf>-V<inf>sg</inf>) of a SWCNT-FET with 1.5µm gate-length and 3µm source-drain separation measured in the ambient environment when V<inf>sg</inf> is swept from −1.5V to 1V and back to −1.5V. Virtually no hysteresis is observed in the IV characteristics of this device. Figure 3 shows I<inf>d</inf>-V<inf>sd</inf> characteristics of the same device with a maximum on current of 14µA and a maximum transconductance of 6µS at a drain bias of V<inf>sd</inf> = 1.5V and gate bias of V<inf>sg</inf> = −0.75V. A drain resistance (R) of 120kΩ due to schottky barrier at the drain contact was extracted from IV curves. Drain current in the linear region was modeled according to I<inf>d</inf> = μ<inf>eff</inf>C<inf>g</inf>(V<inf>sg</inf>+V<inf>t</inf>)V<inf>sd</inf>/ (L+Rμ<inf>eff</inf>C<inf>g</inf>(V<inf>sg</inf>+V<inf>t</inf> where C<inf>g</inf> = 2πε<inf>0</inf>ε / cosh<sup>−1</sup>(1+h/ r) ∼ 28af / nm presuming a cylindrical tube model is the gate capacitance per unit length per number of CNTs in the device structure, L is the gate length, ε<inf>r</inf> = 15 is the effective dielectric constant of HfO<inf>2</inf>, r = 0.5∼2nm is the radius of CNT, h = 20nm is the gate oxide thickness and μ<inf>eff</inf> is the effective field-effect mobility of holes in SWCNT channel. In the current saturation regime where V<inf>sd</inf> ≥ V<inf>sg</inf>+V<inf>t</inf>+RI<inf>d</inf>, SWCNT-FET has a semi-ballistic transport with a drain current modeled as I<inf>d</inf> = K(V<inf>sg</inf>+V<inf>t</inf>)<sup>3/2</sup>(1+λV<inf>sd</inf>, with effective transconductance K = 1.7×10<sup>−6</sup> [A/V<sup>1.5</sup>] and channel length modulation parameter λ = 0.2V<sup>−1</sup> are estimated from the measured data. Linear and saturation models are also shown in Fig. 3. Note that the drain resistance R does not influence the current in the saturation regime, but limits it to large source-drain voltages and small effective source-gate voltages V<inf>sg</inf> + V<inf>t</inf>.","PeriodicalId":396875,"journal":{"name":"68th Device Research Conference","volume":"31 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2010-06-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"DC and flicker noise models for passivated single-walled carbon nanotube transistors\",\"authors\":\"Lin Yu, Sunkook Kim, S. Mohammadi\",\"doi\":\"10.1109/DRC.2010.5551865\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"DC and intrinsic low frequency noise properties of p-channel depletion-mode single-walled carbon nanotube field effect transistors (SWCNT-FETs) are investigated. To characterize the intrinsic noise properties a thin atomic layer deposited (ALD) HfO<inf>2</inf> gate dielectric which also works as a passivation layer is used to isolate SWCNT-FETs from environmental factors. The SWCNT-FET devices (a prototypical device with 1 CNT is shown in Fig. 1) are fabricated on Si substrate with a 300nm SiO<inf>2</inf> thermal oxide. Iron catalyst patterns are defined by UV photolithography with a 10µm spacing and subsequent iron deposition and lift-off. Single-walled carbon nanotubes (SWCNTs) are then synthesized by chemical vapor deposition (CVD) of methane on the substrate coated with patterned Iron catalyst. Source and drain contacts separated by 3µm are formed by electron beam deposition of Pd metal. A 20nm high-k HfO<inf>2</inf> film is deposited using ASM Micro-chemistry F-120 ALCVD<sup>™</sup> Reactor at 300°C by using precursor of HfCl<inf>4</inf> and H<inf>2</inf>O. Top Gate metal is defined by UV photolithography followed by the deposition of Cr/Au (10/50nm) with a minimum gate length of 1.5 µm. Cr/Au (20/450nm) metal interconnects are finally deposited on top of the source and drain Pd contacts. Fig. 2 shows transfer characteristics (I<inf>d</inf>-V<inf>sg</inf>) of a SWCNT-FET with 1.5µm gate-length and 3µm source-drain separation measured in the ambient environment when V<inf>sg</inf> is swept from −1.5V to 1V and back to −1.5V. Virtually no hysteresis is observed in the IV characteristics of this device. Figure 3 shows I<inf>d</inf>-V<inf>sd</inf> characteristics of the same device with a maximum on current of 14µA and a maximum transconductance of 6µS at a drain bias of V<inf>sd</inf> = 1.5V and gate bias of V<inf>sg</inf> = −0.75V. A drain resistance (R) of 120kΩ due to schottky barrier at the drain contact was extracted from IV curves. Drain current in the linear region was modeled according to I<inf>d</inf> = μ<inf>eff</inf>C<inf>g</inf>(V<inf>sg</inf>+V<inf>t</inf>)V<inf>sd</inf>/ (L+Rμ<inf>eff</inf>C<inf>g</inf>(V<inf>sg</inf>+V<inf>t</inf> where C<inf>g</inf> = 2πε<inf>0</inf>ε / cosh<sup>−1</sup>(1+h/ r) ∼ 28af / nm presuming a cylindrical tube model is the gate capacitance per unit length per number of CNTs in the device structure, L is the gate length, ε<inf>r</inf> = 15 is the effective dielectric constant of HfO<inf>2</inf>, r = 0.5∼2nm is the radius of CNT, h = 20nm is the gate oxide thickness and μ<inf>eff</inf> is the effective field-effect mobility of holes in SWCNT channel. In the current saturation regime where V<inf>sd</inf> ≥ V<inf>sg</inf>+V<inf>t</inf>+RI<inf>d</inf>, SWCNT-FET has a semi-ballistic transport with a drain current modeled as I<inf>d</inf> = K(V<inf>sg</inf>+V<inf>t</inf>)<sup>3/2</sup>(1+λV<inf>sd</inf>, with effective transconductance K = 1.7×10<sup>−6</sup> [A/V<sup>1.5</sup>] and channel length modulation parameter λ = 0.2V<sup>−1</sup> are estimated from the measured data. Linear and saturation models are also shown in Fig. 3. 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引用次数: 1

摘要

研究了p沟道耗尽模式单壁碳纳米管场效应晶体管(swcnts - fet)的直流和本征低频噪声特性。为了表征固有噪声特性,采用薄原子层沉积(ALD) HfO2栅极电介质作为钝化层,将swcnts - fet与环境因素隔离。swcnts - fet器件(如图1所示为1个碳纳米管的原型器件)是用300nm SiO2热氧化物在Si衬底上制备的。铁催化剂模式是通过10微米间距的UV光刻和随后的铁沉积和剥离来定义的。然后通过化学气相沉积(CVD)在涂有图案铁催化剂的衬底上制备甲烷单壁碳纳米管(SWCNTs)。通过电子束沉积金属钯形成源极和漏极触点,触点间距为3µm。采用ASM微化学F-120 ALCVD™反应器,以HfCl4和H2O为前驱体,在300℃条件下制备了20nm高钾HfO2薄膜。顶栅金属由UV光刻确定,然后沉积Cr/Au (10/50nm),最小栅长为1.5µm。Cr/Au (20/450nm)金属互连最终沉积在源极和漏极Pd触点的顶部。图2显示了当Vsg从−1.5 v扫频到1V并返回到−1.5 v时,在环境环境中测量的栅极长度为1.5µm、源漏分离为3µm的swcnts - fet的转移特性(Id-Vsg)。该装置的静脉特性几乎没有观察到迟滞。图3显示了同一器件在漏极偏置Vsd = 1.5V,栅极偏置Vsg = - 0.75V时,最大导通电流为14µa,最大跨导为6µS的Id-Vsd特性。从静脉曲线图中提取了由于漏极接触处肖特基屏障引起的漏极阻力(R) 120kΩ。漏极电流的线性区域建模根据Id =μeffCg (Vsg + Vt)房间隔缺损(L + R /μeffCg (Vsg + Vt Cg = 2πεε0 / cosh−1 (1 + h / R)∼28 af / nm,假设一个圆柱管模型栅极电容每单位长度的碳纳米管器件结构,L是门长度,εR = 15是HfO2的有效介电常数,R = 0.5∼2 nm问的半径,h = 20 nm的栅氧化层厚度和μeff是漏洞的有效场效应迁移率SWCNT通道。在Vsd≥Vsg+Vt+RId的电流饱和状态下,swcnts - fet具有半弹道输运,漏极电流模型为Id = K(Vsg+Vt)3/2(1+λVsd),有效跨导K = 1.7×10−6 [a /V1.5],通道长度调制参数λ = 0.2V−1。线性模型和饱和模型如图3所示。请注意,漏极电阻R不影响饱和状态下的电流,但将其限制在较大的源极漏极电压和较小的有效源极栅极电压Vsg + Vt。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
DC and flicker noise models for passivated single-walled carbon nanotube transistors
DC and intrinsic low frequency noise properties of p-channel depletion-mode single-walled carbon nanotube field effect transistors (SWCNT-FETs) are investigated. To characterize the intrinsic noise properties a thin atomic layer deposited (ALD) HfO2 gate dielectric which also works as a passivation layer is used to isolate SWCNT-FETs from environmental factors. The SWCNT-FET devices (a prototypical device with 1 CNT is shown in Fig. 1) are fabricated on Si substrate with a 300nm SiO2 thermal oxide. Iron catalyst patterns are defined by UV photolithography with a 10µm spacing and subsequent iron deposition and lift-off. Single-walled carbon nanotubes (SWCNTs) are then synthesized by chemical vapor deposition (CVD) of methane on the substrate coated with patterned Iron catalyst. Source and drain contacts separated by 3µm are formed by electron beam deposition of Pd metal. A 20nm high-k HfO2 film is deposited using ASM Micro-chemistry F-120 ALCVD Reactor at 300°C by using precursor of HfCl4 and H2O. Top Gate metal is defined by UV photolithography followed by the deposition of Cr/Au (10/50nm) with a minimum gate length of 1.5 µm. Cr/Au (20/450nm) metal interconnects are finally deposited on top of the source and drain Pd contacts. Fig. 2 shows transfer characteristics (Id-Vsg) of a SWCNT-FET with 1.5µm gate-length and 3µm source-drain separation measured in the ambient environment when Vsg is swept from −1.5V to 1V and back to −1.5V. Virtually no hysteresis is observed in the IV characteristics of this device. Figure 3 shows Id-Vsd characteristics of the same device with a maximum on current of 14µA and a maximum transconductance of 6µS at a drain bias of Vsd = 1.5V and gate bias of Vsg = −0.75V. A drain resistance (R) of 120kΩ due to schottky barrier at the drain contact was extracted from IV curves. Drain current in the linear region was modeled according to Id = μeffCg(Vsg+Vt)Vsd/ (L+RμeffCg(Vsg+Vt where Cg = 2πε0ε / cosh−1(1+h/ r) ∼ 28af / nm presuming a cylindrical tube model is the gate capacitance per unit length per number of CNTs in the device structure, L is the gate length, εr = 15 is the effective dielectric constant of HfO2, r = 0.5∼2nm is the radius of CNT, h = 20nm is the gate oxide thickness and μeff is the effective field-effect mobility of holes in SWCNT channel. In the current saturation regime where Vsd ≥ Vsg+Vt+RId, SWCNT-FET has a semi-ballistic transport with a drain current modeled as Id = K(Vsg+Vt)3/2(1+λVsd, with effective transconductance K = 1.7×10−6 [A/V1.5] and channel length modulation parameter λ = 0.2V−1 are estimated from the measured data. Linear and saturation models are also shown in Fig. 3. Note that the drain resistance R does not influence the current in the saturation regime, but limits it to large source-drain voltages and small effective source-gate voltages Vsg + Vt.
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