应用锁定热成像技术定位由可靠性失效机制引起的电活性缺陷

2013 IEEE International Reliability Physics Symposium (IRPS) Pub Date : 2013-04-14 DOI:10.1109/IRPS.2013.6532027

C. Schmidt, K. Wadhwa, A. Reverdy, E. Reinders

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引用次数: 14

摘要

本文提出并介绍了锁相热成像(LIT)方法，这是一种定位由可靠性相关失效机制引起的电活性缺陷的有效方法。在简要介绍了物理原理之后，给出了几个案例研究。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Localization of electrical active defects caused by reliability-related failure mechanism by the application of Lock-in Thermography

Within this paper, the method of Lock-in Thermography (LIT) is presented and introduced as an useful method for localizing electrical active defects caused by reliability-related failure mechanism. After a short introduction of the physical principle, several case studies are presented.

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2013 IEEE International Reliability Physics Symposium (IRPS)

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