基于ECR的表面接触比预测方法研究

K. Fujimi, T. Hatakeyama, S. Nakagawa, R. Kibushi, M. Ishizuka
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引用次数: 0

摘要

热接触电阻(TCR)是电子器件热管理中的一个重要参数。然而,由于低压下固体间接触比的计算方法尚未建立,TCR预测的准确性有待提高。因此,我们着重于使用电接触电阻(ECR)来计算接触比。在本研究中,将实测的TCR与传统预测方程计算的TCR进行了比较,并利用实测ECR的接触比进行了比较。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Study on the Method for Predicting Surface Contact Ratio Using ECR
Thermal contact resistance (TCR) is an important parameter in the thermal management of electronics. However, the accuracy of the TCR prediction should be improved because the method for calculating the contact ratio between solids at low pressures has not yet been established. Therefore, we focus on the use of electric contact resistance (ECR) to calculate the contact ratio. In this study, the measured TCR are compared with the TCR calculated from the conventional prediction equation with the contact ratio from the measured ECR.
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