智能电源集成电路研究方向

D. Monticelli
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引用次数: 2

摘要

一种新型的超大规模集成电路正在出现:包含大功率器件的芯片与控制电路相结合。智能电源IC将系统的小信号输出转换为驱动负载,通常在此过程中传导许多安培并承受数百伏特的电压。目前的集成电路包括保护、状态或脉冲宽度控制等功能,并不断向更复杂的方向发展。该小组将从各个方面探讨巧实力的未来。功率器件的性质及其智能程度将根据新的制造工艺进行评估,并考虑MOS与双极数字与模拟,单片与多芯片解决方案,标准与定制以及封装的挑战。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Directions in smart power ICs
A new breed of VLSI is emerging: dies containing large power devices in combination with control circuitry. The smart power IC converts the small signal output of a system to drive a load, often conducting many amperes and standing off hundreds of volts in so doing. Present ICs involve such functions as protection, status or pulse width control and are constantly evolving towards expanding sophistication. The panel will explore the future of smart power in all of its aspects. The nature of the power device(s) and the extent of its intelligence will be assessed in light of new fabrication processes and consider MOS versus bipolar digital versus analog, monolithic versus multiple die solutions, standard versus custom and the challenge of packaging.
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