Isao Sugaya, Hajime Mitsuishi, Hidehiro Maeda, K. Okamoto
{"title":"3DIC晶圆键合新技术","authors":"Isao Sugaya, Hajime Mitsuishi, Hidehiro Maeda, K. Okamoto","doi":"10.1109/3DIC.2015.7334575","DOIUrl":null,"url":null,"abstract":"A new precision wafer-to-wafer (W2W) bonding system for three-dimensional integrated circuits (3DICs) fabrication including a new precision alignment methodology and a unique thermocompression bonding procedure is proposed. Experimental results show that the alignment capability is 100 nm or better, and permanent bonding accuracy of 260 nm (|mean| + 3σ) in 300 mm Cu wafer bonding. An analysis of overlay error components is useful for identifying the causes of the error and improving the tool conditions. These capabilities are key enablers for the future of cost-effective 3DIC manufacturing.","PeriodicalId":253726,"journal":{"name":"2015 International 3D Systems Integration Conference (3DIC)","volume":"16 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2015-11-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":"{\"title\":\"New precision wafer bonding technologies for 3DIC\",\"authors\":\"Isao Sugaya, Hajime Mitsuishi, Hidehiro Maeda, K. Okamoto\",\"doi\":\"10.1109/3DIC.2015.7334575\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A new precision wafer-to-wafer (W2W) bonding system for three-dimensional integrated circuits (3DICs) fabrication including a new precision alignment methodology and a unique thermocompression bonding procedure is proposed. Experimental results show that the alignment capability is 100 nm or better, and permanent bonding accuracy of 260 nm (|mean| + 3σ) in 300 mm Cu wafer bonding. An analysis of overlay error components is useful for identifying the causes of the error and improving the tool conditions. These capabilities are key enablers for the future of cost-effective 3DIC manufacturing.\",\"PeriodicalId\":253726,\"journal\":{\"name\":\"2015 International 3D Systems Integration Conference (3DIC)\",\"volume\":\"16 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2015-11-23\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"6\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2015 International 3D Systems Integration Conference (3DIC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/3DIC.2015.7334575\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2015 International 3D Systems Integration Conference (3DIC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/3DIC.2015.7334575","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A new precision wafer-to-wafer (W2W) bonding system for three-dimensional integrated circuits (3DICs) fabrication including a new precision alignment methodology and a unique thermocompression bonding procedure is proposed. Experimental results show that the alignment capability is 100 nm or better, and permanent bonding accuracy of 260 nm (|mean| + 3σ) in 300 mm Cu wafer bonding. An analysis of overlay error components is useful for identifying the causes of the error and improving the tool conditions. These capabilities are key enablers for the future of cost-effective 3DIC manufacturing.
求助内容：
应助结果提醒方式：
京公网安备 11010802042870号
