{"title":"x波段发射/接收模块概述","authors":"B. Kopp","doi":"10.1109/MWSYM.2000.863280","DOIUrl":null,"url":null,"abstract":"This paper will discuss pertinent issues and trends in X-band transmit/receive (T/R) modules. The performance of gallium arsenide (GaAs) T/R module components and wide bandgap semiconductors will be presented along with future challenges. T/R module cost will also be addressed with an emphasis on semiconductor cost factors and issues. Finally, a brief discussion of packaging and assembly issues will be provided.","PeriodicalId":149404,"journal":{"name":"2000 IEEE MTT-S International Microwave Symposium Digest (Cat. No.00CH37017)","volume":"2 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2000-06-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"20","resultStr":"{\"title\":\"X-band transmit/receive module overview\",\"authors\":\"B. Kopp\",\"doi\":\"10.1109/MWSYM.2000.863280\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper will discuss pertinent issues and trends in X-band transmit/receive (T/R) modules. The performance of gallium arsenide (GaAs) T/R module components and wide bandgap semiconductors will be presented along with future challenges. T/R module cost will also be addressed with an emphasis on semiconductor cost factors and issues. Finally, a brief discussion of packaging and assembly issues will be provided.\",\"PeriodicalId\":149404,\"journal\":{\"name\":\"2000 IEEE MTT-S International Microwave Symposium Digest (Cat. No.00CH37017)\",\"volume\":\"2 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2000-06-11\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"20\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2000 IEEE MTT-S International Microwave Symposium Digest (Cat. No.00CH37017)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/MWSYM.2000.863280\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2000 IEEE MTT-S International Microwave Symposium Digest (Cat. No.00CH37017)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MWSYM.2000.863280","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
This paper will discuss pertinent issues and trends in X-band transmit/receive (T/R) modules. The performance of gallium arsenide (GaAs) T/R module components and wide bandgap semiconductors will be presented along with future challenges. T/R module cost will also be addressed with an emphasis on semiconductor cost factors and issues. Finally, a brief discussion of packaging and assembly issues will be provided.
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