面向物联网中大规模器件应用的面隧效应管设计指南

E. Hsieh, J. Lee, M. H. Lee, S. Chung
{"title":"面向物联网中大规模器件应用的面隧效应管设计指南","authors":"E. Hsieh, J. Lee, M. H. Lee, S. Chung","doi":"10.23919/SNW.2017.8242268","DOIUrl":null,"url":null,"abstract":"A thorough understanding on how to design and to manufacture a face-tunneling TFET (f-TFET) has been provided. By taking advantage of an area-tunneling, in comparison to conventional point-tunneling FET, f-TFET can be enhanced in its current. This work shows I0„ of f-TFET with one-order magnitude I„n enhancement than that of point-TFET(control), and the longer the gate length is, the higher the becomes. However, from experimental results, S.S. of f-TFET is a little worse than that of control and shows strong dependency on temperature because of dominance of trap-assisted tunneling. To understand how traps affect Ion of f-TFET, the charge-pumping measurement is utilized to examine trap distributions in the tunneling region. The results show that the channel/source interfacial traps degrade the performance of f-TFET, however, with careful treatment of the epi-process of f-TFET, this device with face-tunneling shows great potential for future IoT applications.","PeriodicalId":424135,"journal":{"name":"2017 Silicon Nanoelectronics Workshop (SNW)","volume":"17 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"The guideline on designing face-tunneling FET for large-scale-device applications in IoT\",\"authors\":\"E. Hsieh, J. Lee, M. H. Lee, S. Chung\",\"doi\":\"10.23919/SNW.2017.8242268\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A thorough understanding on how to design and to manufacture a face-tunneling TFET (f-TFET) has been provided. By taking advantage of an area-tunneling, in comparison to conventional point-tunneling FET, f-TFET can be enhanced in its current. This work shows I0„ of f-TFET with one-order magnitude I„n enhancement than that of point-TFET(control), and the longer the gate length is, the higher the becomes. However, from experimental results, S.S. of f-TFET is a little worse than that of control and shows strong dependency on temperature because of dominance of trap-assisted tunneling. To understand how traps affect Ion of f-TFET, the charge-pumping measurement is utilized to examine trap distributions in the tunneling region. The results show that the channel/source interfacial traps degrade the performance of f-TFET, however, with careful treatment of the epi-process of f-TFET, this device with face-tunneling shows great potential for future IoT applications.\",\"PeriodicalId\":424135,\"journal\":{\"name\":\"2017 Silicon Nanoelectronics Workshop (SNW)\",\"volume\":\"17 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1900-01-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2017 Silicon Nanoelectronics Workshop (SNW)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.23919/SNW.2017.8242268\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 Silicon Nanoelectronics Workshop (SNW)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/SNW.2017.8242268","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

摘要

本文对面隧穿TFET的设计和制造进行了深入的了解。与传统的点隧穿效应管相比,利用区域隧穿效应管可以增强其电流。本研究表明,与点tfet(控制)相比,f-TFET具有1”n量级的增强,且栅极长度越长,增强幅度越大。然而,从实验结果来看,由于陷阱辅助隧穿的优势,f-TFET的S.S.略差于对照,并且对温度有很强的依赖性。为了了解陷阱如何影响f-TFET的离子,利用电荷泵送测量来检查隧道区域的陷阱分布。结果表明,通道/源界面陷阱会降低f-TFET的性能,然而,通过仔细处理f-TFET的外延过程,这种具有表面隧道的器件在未来的物联网应用中显示出巨大的潜力。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
The guideline on designing face-tunneling FET for large-scale-device applications in IoT
A thorough understanding on how to design and to manufacture a face-tunneling TFET (f-TFET) has been provided. By taking advantage of an area-tunneling, in comparison to conventional point-tunneling FET, f-TFET can be enhanced in its current. This work shows I0„ of f-TFET with one-order magnitude I„n enhancement than that of point-TFET(control), and the longer the gate length is, the higher the becomes. However, from experimental results, S.S. of f-TFET is a little worse than that of control and shows strong dependency on temperature because of dominance of trap-assisted tunneling. To understand how traps affect Ion of f-TFET, the charge-pumping measurement is utilized to examine trap distributions in the tunneling region. The results show that the channel/source interfacial traps degrade the performance of f-TFET, however, with careful treatment of the epi-process of f-TFET, this device with face-tunneling shows great potential for future IoT applications.
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