O. Thomas, B. Guillaumot, T. Ernst, B. Cousin, O. Rozeau
{"title":"采用45nm多通道场效应晶体管技术的低功耗、高稳定性6T SRAM单元","authors":"O. Thomas, B. Guillaumot, T. Ernst, B. Cousin, O. Rozeau","doi":"10.1109/ESSDERC.2008.4681721","DOIUrl":null,"url":null,"abstract":"This paper presents an innovative 3D CMOS 6T SRAM cell design in multi-channel (MC) FET technology by well adapting the number of channels per device. A simulation model for the 45 nm MCFET has been developed based on silicon measurements. The electrical results validated by simulations, exhibit more than 25% power dissipation reduction and 17% cell stability improvement for the same area and read access time, when compared with a standard CMOS 6T SRAM cell designed in 2D.","PeriodicalId":121088,"journal":{"name":"ESSDERC 2008 - 38th European Solid-State Device Research Conference","volume":"21 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2008-11-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"A power-efficient impoved-stability 6T SRAM cell in 45nm Multi-Channel FET technology\",\"authors\":\"O. Thomas, B. Guillaumot, T. Ernst, B. Cousin, O. Rozeau\",\"doi\":\"10.1109/ESSDERC.2008.4681721\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents an innovative 3D CMOS 6T SRAM cell design in multi-channel (MC) FET technology by well adapting the number of channels per device. A simulation model for the 45 nm MCFET has been developed based on silicon measurements. The electrical results validated by simulations, exhibit more than 25% power dissipation reduction and 17% cell stability improvement for the same area and read access time, when compared with a standard CMOS 6T SRAM cell designed in 2D.\",\"PeriodicalId\":121088,\"journal\":{\"name\":\"ESSDERC 2008 - 38th European Solid-State Device Research Conference\",\"volume\":\"21 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2008-11-18\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"ESSDERC 2008 - 38th European Solid-State Device Research Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ESSDERC.2008.4681721\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"ESSDERC 2008 - 38th European Solid-State Device Research Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ESSDERC.2008.4681721","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A power-efficient impoved-stability 6T SRAM cell in 45nm Multi-Channel FET technology
This paper presents an innovative 3D CMOS 6T SRAM cell design in multi-channel (MC) FET technology by well adapting the number of channels per device. A simulation model for the 45 nm MCFET has been developed based on silicon measurements. The electrical results validated by simulations, exhibit more than 25% power dissipation reduction and 17% cell stability improvement for the same area and read access time, when compared with a standard CMOS 6T SRAM cell designed in 2D.