电子元件本体缺陷和引线腐蚀的人工智能检测及其发生机理研究

Eyal Weiss
{"title":"电子元件本体缺陷和引线腐蚀的人工智能检测及其发生机理研究","authors":"Eyal Weiss","doi":"10.1109/IPFA55383.2022.9915776","DOIUrl":null,"url":null,"abstract":"A large-scale evaluation of the quality of electronic components at the time of the electronic board assembly is presented. Counterfeit components are often recycled or old component, therefore, the quality of components and the soldering leads is a good indicator of the component’s authenticity. The quality of the components is evaluated based on their visual appearance by quantifying their visual defects and the corrosion evidence as they appear on the component and its soldering leads. The effect of body defects and corrosion in the soldering leads on the reliability of the component bond to the board is reviewed. A machine learning method to detect body defects and evidence of corrosion on soldering leads is presented. Over 11 million components images were inspected by the presented AI algorithm. It is shown that 290 components out of a million had body visual defects that cannot be seen by conventional AOI. In addition, over 1,100 out of million had visible corrosion evidence on their soldering leads. Corrosion on the soldering not only affects the production yield but is the most common cause for random statistical failures in the field resulting in products failure. The presented method allows inspection of all the components used in production thus reducing the risk of failures in the field caused by poor quality electronic components originating from counterfeit, and poor storage or handling conditions.","PeriodicalId":378702,"journal":{"name":"2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-07-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"AI Detection of Body Defects and Corrosion on Leads in Electronic Components, and a study of their Occurrence\",\"authors\":\"Eyal Weiss\",\"doi\":\"10.1109/IPFA55383.2022.9915776\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A large-scale evaluation of the quality of electronic components at the time of the electronic board assembly is presented. Counterfeit components are often recycled or old component, therefore, the quality of components and the soldering leads is a good indicator of the component’s authenticity. The quality of the components is evaluated based on their visual appearance by quantifying their visual defects and the corrosion evidence as they appear on the component and its soldering leads. The effect of body defects and corrosion in the soldering leads on the reliability of the component bond to the board is reviewed. A machine learning method to detect body defects and evidence of corrosion on soldering leads is presented. Over 11 million components images were inspected by the presented AI algorithm. It is shown that 290 components out of a million had body visual defects that cannot be seen by conventional AOI. In addition, over 1,100 out of million had visible corrosion evidence on their soldering leads. Corrosion on the soldering not only affects the production yield but is the most common cause for random statistical failures in the field resulting in products failure. The presented method allows inspection of all the components used in production thus reducing the risk of failures in the field caused by poor quality electronic components originating from counterfeit, and poor storage or handling conditions.\",\"PeriodicalId\":378702,\"journal\":{\"name\":\"2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2022-07-18\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IPFA55383.2022.9915776\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IPFA55383.2022.9915776","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2

摘要

提出了一种在电子电路板组装时对电子元件质量进行大规模评价的方法。假冒元器件往往是回收或旧元器件,因此,元器件和焊锡引线的质量是元器件真伪的一个很好的指标。通过量化元件及其焊接引线上出现的视觉缺陷和腐蚀证据,根据其视觉外观来评估元件的质量。讨论了焊锡导线的本体缺陷和腐蚀对元件与电路板连接可靠性的影响。提出了一种机器学习方法来检测焊接引线上的身体缺陷和腐蚀证据。提出的人工智能算法检测了超过1100万张组件图像。结果显示,百万分之290的组件有常规AOI无法看到的身体视觉缺陷。此外,超过1100万的焊锡引线有明显的腐蚀迹象。焊接上的腐蚀不仅影响生产成品率,而且是现场随机统计故障导致产品故障的最常见原因。所提出的方法允许检查生产中使用的所有组件,从而降低由假冒伪劣电子组件和不良存储或处理条件引起的现场故障风险。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
AI Detection of Body Defects and Corrosion on Leads in Electronic Components, and a study of their Occurrence
A large-scale evaluation of the quality of electronic components at the time of the electronic board assembly is presented. Counterfeit components are often recycled or old component, therefore, the quality of components and the soldering leads is a good indicator of the component’s authenticity. The quality of the components is evaluated based on their visual appearance by quantifying their visual defects and the corrosion evidence as they appear on the component and its soldering leads. The effect of body defects and corrosion in the soldering leads on the reliability of the component bond to the board is reviewed. A machine learning method to detect body defects and evidence of corrosion on soldering leads is presented. Over 11 million components images were inspected by the presented AI algorithm. It is shown that 290 components out of a million had body visual defects that cannot be seen by conventional AOI. In addition, over 1,100 out of million had visible corrosion evidence on their soldering leads. Corrosion on the soldering not only affects the production yield but is the most common cause for random statistical failures in the field resulting in products failure. The presented method allows inspection of all the components used in production thus reducing the risk of failures in the field caused by poor quality electronic components originating from counterfeit, and poor storage or handling conditions.
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