基于硅纳米光子学的高速VLSI芯片的光互连技术

K. Ohashi, J. Fujikata, M. Nakada, T. Ishi, K. Nishi, H. Yamada, M. Fukaishi, M. Mizuno, K. Nose, I. Ogura, Y. Urino, T. Baba
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引用次数: 12

摘要

光电和电光元件集成在VLSI芯片上。纳米光电二极管的结电容极低(150pm/V),适用于片上调制器。介绍了一种在硅芯片上实现高速光互连的新方法。这个概念使用硅上的纳米光电二极管,具有极低的寄生电容(小于10aF),可以在非常高的频率下实现稳健的通信。结果显示,5GHz的时钟有望达到20GHz。作者还将讨论如何将硅纳米光电二极管用于波分复用和片上和片外光通信的低压电光调制器
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Optical interconnect technologies for high-speed VLSI chips using silicon nano-photonics
Optoelectronic and electrooptic elements are integrated on VLSI chips. The junction capacitance of a nano-photodiode is extremely low (<10aF), which permits a high load resistance to be used, resulting in higher output voltage at high frequencies. A ceramic Pb(,ZrTi)O3 film with average crystallite diameter below 20nm has a high electro-optical coefficient (>150pm/V) suitable for on-chip modulators. This paper introduces a new approach for realizing high-speed optical interconnects on silicon chips. This concept uses nano-photodiodes on silicon with extremely low parasitic capacitance (less than 10aF) enabling robust communication at very high frequencies. The results demonstrate 5GHz clocking with the promise of up to 20GHz. The authors will also discuss how the silicon nano-photodiode can be used for wavelength-division multiplexing and low-voltage electro-optic modulators for on-chip and off-chip optical communications
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