毫米波变压器耦合低功率和宽带功率放大器

Bo Chen, Liheng Lou, Kai Tang, Jianjun Gao, Yuanjin Zheng
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引用次数: 1

摘要

本文介绍了在130 nm CMOS工艺中实现的两个毫米波PAs。功率放大器采用变压器和传输线匹配拓扑结构,实现了小面积和宽带。一个功率放大器专注于低功耗,另一个专注于宽带。低功耗功率放大器工作在1.2 V电源,10db增益在62 GHz,并消耗58 mW直流功率。在50 GHz至75 GHz范围内,反向隔离优于39 dB。宽带功率放大器的实测3db带宽为20 GHz(从47 GHz到67 GHz);测量的最大增益为8.6 dB;输出1db压缩功率为9.36 dBm,消耗1.2 V直流电源90ma电流。包括衬垫在内,PA的芯片面积为0.318 mm2,不包括衬垫,PA的芯片面积为0.141 mm2。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Millimeter wave transformer coupled low-power and broadband power amplifiers
This paper presents two millimeter wave PAs realized in a 130 nm CMOS process. The power amplifier adopts transformer and transmission line matching topology which achieves small area and broadband. One power amplifier focus on low power and the other focus on broadband. The low-power power amplifier operates from 1.2 V supply with 10 dB gain at 62 GHz, and dissipates 58 mW DC power. Reverse isolation is better than 39 dB from 50 GHz to 75 GHz. The measured 3 dB bandwidth of the broadband power amplifier is 20 GHz (from 47 GHz to 67 GHz); the measured maximum gain is 8.6 dB; output 1 dB compression power is 9.36 dBm and consumes 90 mA current from 1.2 V DC supply. Including its pads, the PA occupies a compact chip area of 0.318 mm2, and without pads, the PA occupies 0.141 mm2.
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