实时微视觉系统的三维集成技术

1997 Proceedings Second Annual IEEE International Conference on Innovative Systems in Silicon Pub Date : 1997-10-08 DOI:10.1109/ICISS.1997.630262

H. Kurino, T. Matsumoto, K. Yu, N. Miyakawa, H. Itani, H. Tsukamoto, M. Koyanagi

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引用次数: 18

摘要

由于三维大规模集成电路可以进行更高层次的并行处理，使得三维大规模集成电路实现具有极高图像处理速度的实时微视觉系统成为可能。然后，我们提出了一种新的三维集成技术，用于这种具有高图像处理速度的实时微视觉系统。开发了埋藏互连和微凸点形成、晶圆减薄、晶圆对准和晶圆键合等三维集成的关键技术。

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Three-dimensional integration technology for real time micro-vision system

It becomes possible to achieve the real time micro-vision system with extremely high image processing speed if three-dimensional LSI comes into reality because a higher level of parallel processing can be performed in three-dimensional LSI. Then, we have proposed a new three-dimensional integration technology for such real time micro-vision system with high image processing speed. Several key technologies for three-dimensional integration such as formation of buried interconnection and micro-bump, wafer thinning, wafer alignment and wafer bonding have been developed.

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1997 Proceedings Second Annual IEEE International Conference on Innovative Systems in Silicon

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