28nm FDSOI技术的能量研究

Rida Kheirallah, N. Azémard, G. Ducharme
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引用次数: 0

摘要

由于摩尔定律的影响,当前技术中的工艺变化正在增加,并对功率和性能产生重大影响,从而导致参数良率损失。因此,工艺的可变性和精确建模晶体管行为的困难阻碍了尺寸缩放的好处。完全耗尽绝缘体上硅(FDSOI)技术是深亚微米器件的主要竞争者之一,因为它们可以在低电压下工作,与体CMOS相比具有更高的能量效率。在本文中,我们研究了28nm FDSOI器件的静态能量,以实现亚阈值电路。对延迟与静态功率权衡的研究揭示了FDSOI对过程变化的鲁棒性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Energy study for 28nm FDSOI technology
Due to the effects of the Moore's law, the process variations in current technologies are increasing and have a major impact on power and performance which results in parametric yield loss. Due to this, process variability and the difficulty of modeling accurately transistor behavior impede the dimensions scaling benefits. The Fully Depleted Silicon-On- Insulator (FDSOI) technology is one of the main contenders for deep submicron devices as they can operate at low voltage with superior energy efficiency compared with bulk CMOS. In this paper, we study the static energy on 28nm FDSOI devices to implement sub-threshold circuits. Study of delay vs. static power trade-off reveals the FDSOI robustness with respect to process variations.
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