Thermal design of an HTP microthruster

A microscale thruster, has been successsfully designed using MEMS technology, in that 'stacked wafer' design is adopted.The thruster is built up of stacked and bonded silicon wafer, each with its own internal structure. The MEMS technology as succeed in acheiveing good performance and relatively short heat-up transient. This paper describes the preliminary design and detailed thermal analysis. The microthruster is designed to be used on small satellites,to deliver small impulse bits micro/nano-satellites for /spl delta/V impulses.