{"title":"并行封装架构设计","authors":"L. Cao, J. Krusius","doi":"10.1109/ECTC.1994.367648","DOIUrl":null,"url":null,"abstract":"Packaging is one of the primary constraints on the performance and partitioning of high density electronic systems. A concurrent design methodology for the design of the physical structure of such systems is presented here. Architecture, electrical, performance and energy management aspects are included. The CAD tool AUDiT implements this design methodology. The concurrent design capability has been illustrated using a model system derived from the high speed Digital Equipment 3000/500 (Alpha) engineering workstation.<<ETX>>","PeriodicalId":344532,"journal":{"name":"1994 Proceedings. 44th Electronic Components and Technology Conference","volume":"55 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1994-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"10","resultStr":"{\"title\":\"Concurrent packaging architecture design\",\"authors\":\"L. Cao, J. Krusius\",\"doi\":\"10.1109/ECTC.1994.367648\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Packaging is one of the primary constraints on the performance and partitioning of high density electronic systems. A concurrent design methodology for the design of the physical structure of such systems is presented here. Architecture, electrical, performance and energy management aspects are included. The CAD tool AUDiT implements this design methodology. The concurrent design capability has been illustrated using a model system derived from the high speed Digital Equipment 3000/500 (Alpha) engineering workstation.<<ETX>>\",\"PeriodicalId\":344532,\"journal\":{\"name\":\"1994 Proceedings. 44th Electronic Components and Technology Conference\",\"volume\":\"55 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1994-05-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"10\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"1994 Proceedings. 44th Electronic Components and Technology Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ECTC.1994.367648\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"1994 Proceedings. 44th Electronic Components and Technology Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.1994.367648","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Packaging is one of the primary constraints on the performance and partitioning of high density electronic systems. A concurrent design methodology for the design of the physical structure of such systems is presented here. Architecture, electrical, performance and energy management aspects are included. The CAD tool AUDiT implements this design methodology. The concurrent design capability has been illustrated using a model system derived from the high speed Digital Equipment 3000/500 (Alpha) engineering workstation.<>
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