用于28ghz天线封装应用的LTCC堆叠贴片阵列

2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) Pub Date : 2017-12-01 DOI:10.1109/EDAPS.2017.8277007

G. Guo, Linsheng Wu, Yao-ping Zhang, J. Mao

{"title":"用于28ghz天线封装应用的LTCC堆叠贴片阵列","authors":"G. Guo, Linsheng Wu, Yao-ping Zhang, J. Mao","doi":"10.1109/EDAPS.2017.8277007","DOIUrl":null,"url":null,"abstract":"An antenna array is designed with 2×8 45-degree polarized stacked patches around 28 GHz in low temperature co-fired ceramic (LTCC) for the applications of the fifth-generation wireless communication (5G). As demonstrated by the measured reflection coefficient and realized gain response, the bandwidth is broadened when compared with single-patch array. The proposed antenna-in-package (AiP) can operate from 26.3 to 29.8 GHz, with the maximum realized gain of 15.1 dBi, the 3-dB beamwidth of 11° and the estimated efficiency of 55%. Reasonable agreement is achieved between the measured and simulated results. The AiP arrays on LTCC show a promising foreground for 5G high-frequency applications.","PeriodicalId":329279,"journal":{"name":"2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)","volume":"20 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2017-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"17","resultStr":"{\"title\":\"Stacked patch array in LTCC for 28 GHz antenna-in-package applications\",\"authors\":\"G. Guo, Linsheng Wu, Yao-ping Zhang, J. Mao\",\"doi\":\"10.1109/EDAPS.2017.8277007\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"An antenna array is designed with 2×8 45-degree polarized stacked patches around 28 GHz in low temperature co-fired ceramic (LTCC) for the applications of the fifth-generation wireless communication (5G). As demonstrated by the measured reflection coefficient and realized gain response, the bandwidth is broadened when compared with single-patch array. The proposed antenna-in-package (AiP) can operate from 26.3 to 29.8 GHz, with the maximum realized gain of 15.1 dBi, the 3-dB beamwidth of 11° and the estimated efficiency of 55%. Reasonable agreement is achieved between the measured and simulated results. The AiP arrays on LTCC show a promising foreground for 5G high-frequency applications.\",\"PeriodicalId\":329279,\"journal\":{\"name\":\"2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)\",\"volume\":\"20 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2017-12-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"17\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EDAPS.2017.8277007\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EDAPS.2017.8277007","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 17

摘要

针对第五代无线通信(5G)的应用，设计了一种采用低温共烧陶瓷(LTCC)材料，在28ghz左右采用2×8 45度极化叠加贴片的天线阵列。测量的反射系数和实现的增益响应表明，与单贴片阵列相比，带宽得到了展宽。该封装天线(antenna-in-package, AiP)工作频率为26.3 ~ 29.8 GHz，最大实现增益为15.1 dBi, 3db波束宽度为11°，估计效率为55%。仿真结果与实测结果吻合较好。基于LTCC的AiP阵列在5G高频应用中具有广阔的应用前景。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

Stacked patch array in LTCC for 28 GHz antenna-in-package applications

An antenna array is designed with 2×8 45-degree polarized stacked patches around 28 GHz in low temperature co-fired ceramic (LTCC) for the applications of the fifth-generation wireless communication (5G). As demonstrated by the measured reflection coefficient and realized gain response, the bandwidth is broadened when compared with single-patch array. The proposed antenna-in-package (AiP) can operate from 26.3 to 29.8 GHz, with the maximum realized gain of 15.1 dBi, the 3-dB beamwidth of 11° and the estimated efficiency of 55%. Reasonable agreement is achieved between the measured and simulated results. The AiP arrays on LTCC show a promising foreground for 5G high-frequency applications.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)

自引率

0.00%

发文量