AlGaN/GaN HEMT栅漏电流对栅场极板效能的影响

Chanchal Chanchal, Ajay Kumar Visvkarma, A. Malik, R. Laishram, D. S. Rawal, M. Saxena
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引用次数: 0

摘要

GaN hemt在射频(RF)和大功率器件和传感应用中得到应用。已经研究了几种类型的GaN HEMT器件结构,并以各种形式使用。本文对栅极场镀器件与传统GaN HEMT器件进行了对比研究。栅漏电流与断态击穿模式有密切的关系。栅极-漏极电场上升一定后,场极板开始工作,在失态击穿特性中产生驼峰。在低栅漏电流器件中,这种模式不存在,表明栅场板在固定电压范围内是有效的。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Dependence of Gate Leakage Current on Efficacy of Gate Field Plate in AlGaN/GaN HEMT
GaN HEMTs finds applications in Radio Frequency (RF) and high-power device and sensing applications. Several types of GaN HEMT device structures have been studied and are being used in various forms. In this article, a comparative study of gate field plated device with a conventional GaN HEMT device has been studied. A close relationship in gate leakage current with off-state breakdown pattern has been observed. The field plate starts working after a certain rise in the gate-drain electric field creating a hump in off-state breakdown characteristic. In low gate leakage device this pattern is absent signifying the effectiveness of gate field plate in fix voltage range.
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