Mems/cmos集成与图像传感器

Proceedings Eleventh Annual IEEE International ASIC Conference (Cat. No.98TH8372) Pub Date : 1998-09-13 DOI:10.1109/ASIC.1998.723042

P. Lee, C. Anagnopoulis

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引用次数: 1

摘要

随着专用集成电路(ASIC)技术向实现电子片上系统(system-on-a-chip)的方向发展，显然需要将电子设备与外部物理世界之间的接口结合起来。这些接口或换能器采用物理参数，如光强度，压力和温度，并将其转换为可以在ASIC的电子领域中起作用的电信号。本次会议将讨论两个新兴领域，即微电子机械系统(MEMS)和图像传感器，这些领域正在寻求与CMOS ASlC的集成。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Mems/cmos Integration & Image Sensors

As the Application Specific Integrated Circuit (ASIC) technology pushes towards realizing electronic system-on-a-chip, it becomes apparent that there is a need for incorporating the interface between electronics and the external physical world. These interfaces or transducers take physical parameters such as light intensity, pressure and temperature and turn them into electrical signals which can be acted on in the electronic domain of the ASIC’s. This sessions deals with 2 emerging areas of Micro-Electronical-Mechanical systems (MEMS) and image sensors where integration with CMOS ASlC are being pursued.

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来源期刊

Proceedings Eleventh Annual IEEE International ASIC Conference (Cat. No.98TH8372)

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