基于标准单元设计的三模光刻感知优化

Jian Kuang, Wing-Kai Chow, Evangeline F. Y. Young
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引用次数: 15

摘要

三重模式光刻技术(TPL)被认为是解决14nm及以上工艺节点制造挑战的一种有前途的技术。为了使布局更友好,降低制造成本,有必要在早期设计阶段考虑第三方物流。在本文中,我们提出了一个共同优化单元布局分解和详细放置的流程。我们的单元分解方法可以枚举所有具有最小缝线数的着色解决方案。实验结果表明,该方法在针数、HPWL和运行时间等方面都优于现有方法。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Triple patterning lithography aware optimization for standard cell based design
Triple Patterning Lithography (TPL) is regarded as a promising technique to handle the manufacturing challenges in 14nm and beyond technology node. It is necessary to consider TPL in early design stages to make the layout more TPL friendly and reduce the manufacturing cost. In this paper, we propose a flow to co-optimize cell layout decomposition and detailed placement. Our cell decomposition approach can enumerate all coloring solutions with the minimum number of stitches. Experimental results show that our approach can outperform the existing work in all aspects of stitch number, HPWL and running time.
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