基于领域划分和模型降阶的互连有效建模

2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2021-10-27 DOI:10.1109/SIITME53254.2021.9663679

G. Ciuprina, D. Ioan

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引用次数: 0

摘要

这篇论文是对我们多年来在主要属于电气工程和数学的科学界中与互连建模和仿真相关的贡献的评论综述。重点是我们认为尚未被电子封装界广泛使用的重要主题，例如电磁场公式中的电路元件边界条件以及整个建模流程中的复杂性降低技术。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Effective Modeling of Interconnects with Domain Partitioning and Model Order Reduction

This paper is a commented review of our contributions related to the modelling and simulation of interconnects, presented throughout the years in scientific communities that belong mainly to electrical engineering and mathematics. The emphasis is on important topics that we feel that are not yet much used by the electronics packaging community, such as the electric circuit element boundary conditions in the electromagnetic field formulation as well as complexity reduction techniques throughout the modelling flow.

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来源期刊

2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME)

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