先进FinFET技术中的器件可靠性挑战

X. Wan
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引用次数: 0

摘要

本文讨论了热载流子注入、偏置温度不稳定性和随时间介电击穿对FinFET性能和可靠性的影响。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Device Reliability Challenges in Advanced FinFET Technology
This article discusses the effect of hot carrier injection, bias temperature instability, and time-dependent dielectric breakdown on FinFET performance and reliability.
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