集成系统的设计，包括MEMS和asic

Proceedings Eleventh Annual IEEE International ASIC Conference (Cat. No.98TH8372) Pub Date : 1998-09-13 DOI:10.1109/ASIC.1998.723044

J. Gilbert, S. Bart, B. Romanowicz

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引用次数: 3

摘要

包含MEMS/MST子系统的产品设计需要自上而下的系统设计方法。我们提出了一种方法，用行为模型和仿真工具来支持子系统设计者，这使得子系统功能在系统架构师的层次上得到规范。三维多物理场仿真用于创建系统级仿真所需的计算效率模型。这里描述的设计方法促进了子系统设计者之间的有效沟通。

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Design of integrated systems including MEMS and ASICs

Design of products containing MEMS/MST subsystems requires a top-down approach to system design. We present a methodology to support the subsystem designers with behavioral models and simulation tools, which enable the specification of subsystem functions at the level of the system architect. 3-D multi-physics simulations are used to create the computationally efficient models required for system level simulations. The design methodology described here facilitates effective communication between the subsystem designers.

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Proceedings Eleventh Annual IEEE International ASIC Conference (Cat. No.98TH8372)

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