一种光子片上网络的设计

A. Shacham, K. Bergman, L. Carloni
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引用次数: 308

摘要

最近在纳米级硅光子集成电路方面取得的显著进展,特别是与CMOS制造相兼容的纳米级硅光子集成电路,为在片上通信基础设施中利用光学技术的独特能力创造了新的机会。基于这些纳米光子构建模块,我们考虑了一种光子网络片上架构,旨在利用光域数据交换所带来的巨大传输带宽、低延迟和低功耗。这种新颖的结构方法采用了一个宽带光子电路交换网络,该网络由一个电子覆盖控制网络以分布式方式驱动,该控制网络也用于独立的短消息交换。我们解决了芯片多处理器(CMP)应用中插入的关键网络设计问题,包括拓扑,路由算法,路径设置和拆卸程序以及死锁避免。仿真表明,这类光子片上网络为CMP芯片通信系统提供了性能上的重大飞跃,在消耗最小功耗的同时提供低延迟和超高每核吞吐量
本文章由计算机程序翻译,如有差异,请以英文原文为准。
On the Design of a Photonic Network-on-Chip
Recent remarkable advances in nanoscale silicon-photonic integrated circuitry specifically compatible with CMOS fabrication have generated new opportunities for leveraging the unique capabilities of optical technologies in the on-chip communications infrastructure. Based on these nano-photonic building blocks, we consider a photonic network-on-chip architecture designed to exploit the enormous transmission bandwidths, low latencies, and low power dissipation enabled by data exchange in the optical domain. The novel architectural approach employs a broadband photonic circuit-switched network driven in a distributed fashion by an electronic overlay control network which is also used for independent exchange of short messages. We address the critical network design issues for insertion in chip multiprocessors (CMP) applications, including topology, routing algorithms, path-setup and tear-down procedures, and deadlock avoidance. Simulations show that this class of photonic networks-on-chip offers a significant leap in the performance for CMP intrachip communication systems delivering low-latencies and ultra-high throughputs per core while consuming minimal power
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