集成电路内部光信号的产生和跟踪,提高器件安全性和故障分析

E. Amini, N. Herfurth, A. Beyreuther, Jean-Pierre Seifert, C. Boit
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引用次数: 0

摘要

通过芯片背面进入集成电路的光信号跟踪技术已经成为硬件攻击中最成功的方法。另一方面,跟踪光信号可以用来保护IC免受这种攻击。此外,该技术是一种有利的失效分析方法。跟踪从表面反射或通过表面传输的光信号,可以揭示有关该表面的一些信息,这些信息可用于监测表面。因此,检测从硅芯片背面反射的光,可以发现对背面的任何伤害和侵犯。为此,我们需要在IC内部产生光,这可以通过在pn结上施加正向偏置来实现。然而,在大多数ic中,硅是基材,硅LED产生的光很弱。此外,这种应用可能导致硅LED的退化。因此,需要在芯片上安装外部产生的更强的光源。本文考虑了在硅内部产生和跟踪光信号的可能方法,以实现适当的保护结构,防止通过硅背表面进行攻击。我们描述了如何将高效的LED集成到集成电路中以照亮所需方向的光,以及哪种LED有利于实现这一目标。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Generation and Tracking of Optical Signals inside the IC to Improve Device Security and Failure Analysis
Optical signal tracking techniques accessing the IC through the chip backside have become the most successful methods in hardware attacks. On the other hand, tracking the optical signal can be employed to protect the IC against such attacks. Furthermore, this technique is an advantageous method for failure analysis. Tracking the optical signal reflected from, or transmitted through a surface, reveals some information about this surface that can be used to monitor the surface. Thus, detection of the light reflected from the silicon chip back surface discloses any harms and violations to the backside. For this purpose, we need to generate light inside the IC, which is possible by applying forward bias to a p-n junction. However, in most ICs, silicon is the base material, and the light generated by silicon LED is weak. Furthermore, this application may lead to degradation of the silicon LED. Therefore, an externally produced a stronger light source mounted onto the chip is desirable. This paper considers possible ways to generate and track optical signals inside the silicon to achieve a proper protection structure that prevents attacks from being carried out through the silicon back surface. We describe how an efficient LED can be integrated into an IC to illuminate light in the demanded directions, as well as which kind of LED is favorable for this target.
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