{"title":"Viking SuperSPARC AMCM开发计划","authors":"C. Eichelberger, H. Davidson","doi":"10.1109/MCMC.1993.302157","DOIUrl":null,"url":null,"abstract":"A program to develop a Viking SuperSparc AMCM is discussed. The program is structured not only to provide a prototype module, but also to resolve key infrastructure issues associated with volume production of the module. The AMCM technology was chosen to fabricate the module. This technology is a chips first approach and offers important advantages in thermal management, power delivery, size and system interface. The program is divided into four phases. The first phase completes the Viking AMCM design and layout. The second phase fabricates and tests first articles. The third place demonstrates bare chip test and burn-in. The final phase produces preproduction qualification samples.<<ETX>>","PeriodicalId":143140,"journal":{"name":"Proceedings 1993 IEEE Multi-Chip Module Conference MCMC-93","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1993-03-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Viking SuperSPARC AMCM development program\",\"authors\":\"C. Eichelberger, H. Davidson\",\"doi\":\"10.1109/MCMC.1993.302157\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A program to develop a Viking SuperSparc AMCM is discussed. The program is structured not only to provide a prototype module, but also to resolve key infrastructure issues associated with volume production of the module. The AMCM technology was chosen to fabricate the module. This technology is a chips first approach and offers important advantages in thermal management, power delivery, size and system interface. The program is divided into four phases. The first phase completes the Viking AMCM design and layout. The second phase fabricates and tests first articles. The third place demonstrates bare chip test and burn-in. The final phase produces preproduction qualification samples.<<ETX>>\",\"PeriodicalId\":143140,\"journal\":{\"name\":\"Proceedings 1993 IEEE Multi-Chip Module Conference MCMC-93\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1993-03-15\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings 1993 IEEE Multi-Chip Module Conference MCMC-93\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/MCMC.1993.302157\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings 1993 IEEE Multi-Chip Module Conference MCMC-93","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MCMC.1993.302157","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A program to develop a Viking SuperSparc AMCM is discussed. The program is structured not only to provide a prototype module, but also to resolve key infrastructure issues associated with volume production of the module. The AMCM technology was chosen to fabricate the module. This technology is a chips first approach and offers important advantages in thermal management, power delivery, size and system interface. The program is divided into four phases. The first phase completes the Viking AMCM design and layout. The second phase fabricates and tests first articles. The third place demonstrates bare chip test and burn-in. The final phase produces preproduction qualification samples.<>
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