超大规模集成电路测试CAD工具的现状及未来趋势

Wu-Tung Cheng
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引用次数: 4

摘要

对于目前的超大规模集成电路设计,有两种广为接受的数字测试技术。一个用于嵌入式存储器,另一个用于逻辑。对于嵌入式存储器,使用内置自检(BIST)。在逻辑方面,主要的解决方案是基于扫描DFT和自动测试模式生成(ATPG)。然而,为了减少使用外部测试器的需要,并简化系统级的测试重用,更多的设计使用BIST来测试逻辑。在未来,随着片上系统(SoC)需求和深亚微米(DSM)技术的发展,我们相信BIST和基于扫描的ATPG将继续成为VLSI测试的主要解决方案。然而,要取得成功,还需要一些改进。作者从三个方面讨论了未来的趋势:测试质量、测试应用成本和测试开发工作。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Current status and future trend on CAD tools for VLSI testing
For current VLSI designs, there are two kinds of well-accepted digital testing technologies. One is for embedded memories and the other is for the logic. For embedded memories, Built-In-Self-Test (BIST) is used. For the logic, the main solutions are based on scan DFT and automatic test pattern generation (ATPG). However, to reduce the need to use an external tester, and to ease test reuse at the system level, more designs are using BIST to test logic. In the future, with system on chip (SoC) requirements and deep Sub-Micron (DSM) technologies, we believe that BIST and scan-based ATPG will continue to be the main solutions to VLSI testing. However, to be successful, some improvements are needed. The author discusses future trends in three categories: test quality, test application cost and test development effort.
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