在SIMOX和BESOI晶圆上制作的CMOS逆变器的总剂量/spl γ /射线辐照特性

Shingyang Zhu, J. Li, Chenglu Lin, J. X. Gao, L. Yan
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引用次数: 0

摘要

测量了在SIMOX和BESOI硅片上制备的CMOS逆变器的总剂量响应特性与辐照过程中累积剂量和偏置条件的关系。利用拉伸技术将PMOS和NMOS的阈值电压位移分离为界面陷阱和捕获氧化物电荷引起的位移。NMOS/SIMOX的泄漏电流在辐照后迅速增加,这是由于寄生的后通道MOS结构。而BESOI器件由于顶部硅层较厚,没有明显的反向通道效应。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Total dose /spl gamma/-ray irradiation characteristics of CMOS inverters fabricated on SIMOX and BESOI wafers
The total dose response characteristics of CMOS inverters fabricated on SIMOX and BESOI wafers were measured as a function of accumulative dose and bias conditions during irradiation. The stretch-out technique was used to separate the threshold-voltage shifts of PMOS and NMOS into shifts due to interface traps and trapped-oxide charge. The leakage currents of NMOS/SIMOX increased quickly after irradiation because of the parasitic back-channel MOS structure. While the BESOI devices suffered no significant back-channel effect due to thick top silicon layers.
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