在外延和非外延技术中，衬底触点的放置以减轻衬底噪声

Proceedings of the 43rd IEEE Midwest Symposium on Circuits and Systems (Cat.No.CH37144) Pub Date : 2000-08-08 DOI:10.1109/MWSCAS.2000.951457

R. Secareanu, S. Warner, S. Seabridge, C. Burke, T. E. Watrobski, C. Morton, W. Staub, T. Tellier, E. Friedman

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引用次数: 4

摘要

分析了在外接和非外接技术中衬底触点的放置，以控制和降低衬底噪声的振幅和传播。强调了两种主要技术的小或大衬底触点或环的选择。此外，还提出了在混合信号智能电源系统中放置基板触点以提高数字电路抗噪声能力的设计准则。

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Placement of substrate contacts to alleviate substrate noise in epi and non-epi technologies

The placement of substrate contacts in epi and non-epi technologies in order to control and reduce the substrate noise amplitude and spreading is analyzed. The choice of small or large substrate contacts or rings for each of the two major technologies are highlighted. Design guidelines for placing substrate contacts particularly appropriate to improving the noise immunity of digital circuits in mixed-signal smart-power systems are also presented.

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Proceedings of the 43rd IEEE Midwest Symposium on Circuits and Systems (Cat.No.CH37144)

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