DRAM中Bulk Trap导致的保留失效分析

D.H. Han, Hoonchang Yang, Jinyeong Hwang, Jinseon Kim, K. Cho, Incheol Nam, D. Kim, Beomseop Lee, Sungsoo Yim, Hee-Il Hong, Jooyoung Lee
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引用次数: 0

摘要

DRAM是一种将每位数据存储在电容单元中的存储器,泄漏电流是保存数据的一个非常重要的电气参数。因此,更大的电池容量和更小的漏电流被认为是DRAM持续收缩的关键因素。一般来说,栅极诱发漏极(GIDL)和电池晶体管(CTR)的结漏漏是众所周知的,但我们的方法主要集中在体积陷阱引起的保持失效。为了电观察体阱的影响,我们使用CTR的相邻栅极来控制电子迁移。结果表明,由于体积陷阱导致的破坏单元较多,尺寸收缩加速了这种破坏。因此,在整体陷阱中应仔细考虑电偏压点和晶体管制造工艺之间的平衡。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Analysis of Retention Failure by Bulk Trap in DRAM
DRAM is a type of memory that stores each bit of data in a capacitor cell, leakage current is a very important electrical parameter to retain data. Therefore, larger cell capacitance and smaller leakage current have been regarded as key factors in continuous shrinkage of DRAM. Generally, gate induced drain leakage (GIDL) and junction leakage of cell transistor (CTR) are well-known, but our approach is focused on retention failure by bulk trap. In order to electrically observe the influence of bulk trap, we used the adjacent gate of CTR to control electron migration. Results show that there are many failure cells due to bulk trap, and dimension shrinkage accelerates this failure. Consequently, balancing among electrical bias point and transistor manufacturing process should be carefully considered with bulk traps.
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