基于pde的器件模拟器中声子边界散射的建模与仿真

O. Tornblad, P. Sverdrup, D. Yergeau, Zhiping Yu, Kenneth E. Goodson, Robert W. Dutton
{"title":"基于pde的器件模拟器中声子边界散射的建模与仿真","authors":"O. Tornblad, P. Sverdrup, D. Yergeau, Zhiping Yu, Kenneth E. Goodson, Robert W. Dutton","doi":"10.1109/SISPAD.2000.871206","DOIUrl":null,"url":null,"abstract":"In this work, the effect of phonon boundary scattering on the heat transfer in thin silicon layers and close to interfaces was investigated. The modeling is applicable to silicon-on-insulator (SOI) devices as well as to conventional bulk technology. From a linearized Boltzmann transport equation (BTE), anisotropic local thermal conductivities are derived. A separate expression is formulated for the case of a bulk device where only one interface is present. Anisotropy was implemented as a finite element-based operator into the PROPHET device simulator and a demonstration of the new electrothermal modeling was made for a conventional MOSFET. The anisotropic local thermal conductivities lead to a temperature increase /spl sim/30% higher at the gate oxide interface compared to conventional modeling.","PeriodicalId":132609,"journal":{"name":"2000 International Conference on Simulation Semiconductor Processes and Devices (Cat. No.00TH8502)","volume":"75 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2000-09-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"8","resultStr":"{\"title\":\"Modeling and simulation of phonon boundary scattering in PDE-based device simulators\",\"authors\":\"O. Tornblad, P. Sverdrup, D. Yergeau, Zhiping Yu, Kenneth E. Goodson, Robert W. Dutton\",\"doi\":\"10.1109/SISPAD.2000.871206\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this work, the effect of phonon boundary scattering on the heat transfer in thin silicon layers and close to interfaces was investigated. The modeling is applicable to silicon-on-insulator (SOI) devices as well as to conventional bulk technology. From a linearized Boltzmann transport equation (BTE), anisotropic local thermal conductivities are derived. A separate expression is formulated for the case of a bulk device where only one interface is present. Anisotropy was implemented as a finite element-based operator into the PROPHET device simulator and a demonstration of the new electrothermal modeling was made for a conventional MOSFET. The anisotropic local thermal conductivities lead to a temperature increase /spl sim/30% higher at the gate oxide interface compared to conventional modeling.\",\"PeriodicalId\":132609,\"journal\":{\"name\":\"2000 International Conference on Simulation Semiconductor Processes and Devices (Cat. No.00TH8502)\",\"volume\":\"75 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2000-09-06\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"8\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2000 International Conference on Simulation Semiconductor Processes and Devices (Cat. No.00TH8502)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/SISPAD.2000.871206\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2000 International Conference on Simulation Semiconductor Processes and Devices (Cat. No.00TH8502)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SISPAD.2000.871206","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 8

摘要

本文研究了声子边界散射对薄硅层和界面附近传热的影响。该模型既适用于传统的体块工艺,也适用于绝缘体上硅(SOI)器件。从线性化的玻尔兹曼输运方程(BTE)中,导出了各向异性的局部热导率。对于只存在一个接口的批量设备,制定了一个单独的表达式。将各向异性作为基于有限元的运算符实现到PROPHET器件模拟器中,并对传统MOSFET进行了新的电热建模演示。与传统模型相比,各向异性的局部热导率导致栅极氧化物界面的温度升高/spl sim/30%。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Modeling and simulation of phonon boundary scattering in PDE-based device simulators
In this work, the effect of phonon boundary scattering on the heat transfer in thin silicon layers and close to interfaces was investigated. The modeling is applicable to silicon-on-insulator (SOI) devices as well as to conventional bulk technology. From a linearized Boltzmann transport equation (BTE), anisotropic local thermal conductivities are derived. A separate expression is formulated for the case of a bulk device where only one interface is present. Anisotropy was implemented as a finite element-based operator into the PROPHET device simulator and a demonstration of the new electrothermal modeling was made for a conventional MOSFET. The anisotropic local thermal conductivities lead to a temperature increase /spl sim/30% higher at the gate oxide interface compared to conventional modeling.
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