面向工艺设计协同优化的模具内空间关联效应建模

Sixth international symposium on quality electronic design (isqed'05) Pub Date : 2005-03-21 DOI:10.1109/ISQED.2005.82

Paul Friedberg, Yu Cao, J. Cain, Ruth Wang, J. Rabaey, C. Spanos

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引用次数: 247

摘要

由于制造变化引起的器件参数值的模内空间相关性对电路性能有重要影响。基于实验和仿真结果，我们:(1)在水平和垂直分离的全场范围内表征栅极长度的空间相关性;(2)建立初步的空间相关模型;(3)研究其对电路性能变异性的影响。

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Modeling within-die spatial correlation effects for process-design co-optimization

Within-die spatial correlation of device parameter values caused by manufacturing variations has a significant impact on circuit performance. Based on experimental and simulation results, we: (1) characterize the spatial correlation of gate length over a full-field range of horizontal and vertical separation; (2) develop a rudimentary spatial correlation model; and (3) investigate its impact an the variability of circuit performance.

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Sixth international symposium on quality electronic design (isqed'05)

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