65 nm薄盒FDSOI工艺中堆叠传输门触发器与堆叠三态逆变触发器的辐射硬度比较

Mitsunori Ebara, Kodai Yamada, J. Furuta, Kazutoshi Kobayashi
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引用次数: 3

摘要

我们测试了堆叠传输门触发器和堆叠三态逆变触发器的辐射硬度,它们分别被称为STACKEDTGFF和STACKEDTIFF。用FDSOI制造的堆叠触发器比批量制造更能抵御软误差,因为所有晶体管通道都被BOX层隔离。通过中子和重离子辐照对软误差容忍度进行了评价。由于沿着数据路径的门的数量不同,STACKEDTIFF比STACKEDTGFF更快。这些FFs不会被中子和LET小于40 MeV-cm2mg的重离子的正常入射翻转。它们比标准TGFF对软错误的抵抗力强两个数量级。我们还研究了重离子对这些FFs的入射角依赖性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Comparison of Radiation Hardness of Stacked Transmission-Gate Flip Flop and Stacked Tristate-Inverter Flip Flop in a 65 nm Thin BOX FDSOI Process
We examined radiation hardness of a stacked transmission-gate flip flop and a stacked tristate-inverter flip flop, which are called STACKEDTGFF and STACKEDTIFF respectively. Stacked flip flops fabricated in FDSOI are stronger against soft errors than in bulk because all transistor channels are isolated by a BOX layer. We evaluated soft-error tolerance by neutron and heavy-ion irradiation. STACKEDTIFF is faster than STACKEDTGFF because of the difference of the number of gates along the data path. Those FFs did not flip by neutrons and the normal incidence of heavy ions with LET of less than 40 MeV-cm2mg. They are stronger against soft errors than a standard TGFF by two order of magnitude. We also investigated incident angle dependence of those FFs by heavy ions.
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