使用现场FPGA故障注入测试具有容错CGRA的soc可靠性技术

Johannes Maximilian Kühn, Thomas Schweizer, Dustin Peterson, T. Kuhn, W. Rosenstiel
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引用次数: 10

摘要

在这项工作中,我们打算展示一些为粗粒度可重构架构(CGRA)开发的可靠性技术。要演示的技术针对片上系统(SoC)设计的不同部分,该部分由通用CPU,各种加速器和可用于应用程序加速的CGRA组成。在CGRA上,我们将演示一种轻量级的三模冗余(TMR)技术,该技术减轻了TMR通常引起的硬件开销。在检测到CGRA故障的情况下,我们使用应用程序的动态重映射来避免出现故障的组件,从而恢复映射应用程序的功能。在SoC级别上,我们演示了动态功能验证以采样,从而以时间复用的方式检测SoC组件中的故障。在现场可编程门阵列(FPGA)上对整个系统进行了仿真,并开发了一种快速准确的故障注入方法,以实时、真实地测试所开发的技术。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Testing reliability techniques for SoCs with fault tolerant CGRA by using live FPGA fault injection
In this work, we intend to demonstrate a number of reliability techniques developed for Coarse Grained Reconfigurable Architectures (CGRA). The techniques to be demonstrated target different portions of a System on Chip (SoC) Design consisting of a general purpose CPU, various accelerators and a CGRA which may be used for application acceleration as well. On the CGRA we will demonstrate a light-weight Triple Modular Redundancy (TMR) technique which mitigates the hardware overhead usually incurred by TMR. In case of a detected CGRA fault, we use Dynamic Remapping of the application to avoid faulty components and thus restore the functionality of the mapped application. On SoC level, we demonstrate Dynamic Functional Verification to sample and thus detect faults in components of the SoC in a time multiplexed manner. The complete system is emulated on a Field Programmable Gate Array (FPGA) for which we developed a fast and accurate fault injection method to test the developed techniques in a live and realistic way.
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