无线前端模块代工SOI技术

P. Hurwitz, S. Chaudry, V. Blaschke, M. Racanelli
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引用次数: 3

摘要

在过去的几年中,RF SOI已经取代GaAs pHEMT成为无线前端模块中RF开关(RFSW)的首选技术。最近,RF SOI也被部署到天线调谐应用中的开关电容器组中,目前正在作为可调谐功率放大器集成的正确技术进行讨论,有望实现单芯片前端模块。在本文中,我们回顾了射频SOI铸造技术的最新进展,重点介绍了关键的优点,如Ron × Coff,开关分支功率处理和线性度。除了这些过程驱动的指标外,我们还将描述紧凑模型和设计环境的属性,这些模型和设计环境允许快速准确地模拟小信号和大信号RFSW性能,从而创建最先进和高度集成的产品。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Foundry SOI technology for wireless front end modules
In the last few years, RF SOI has become the technology of choice for RF switches (RFSW) in wireless front-end modules, displacing GaAs pHEMT. More recently RF SOI has also been deployed to switch capacitor banks in antenna tuning applications and is now being discussed as the right technology for integration of tunable power-amplifiers, promising a path to a single-chip front-end module. In this paper we review the latest advancements in RF SOI foundry technology with focus on key figures of merit such as Ron × Coff, switch branch power handling, and linearity. In addition to these process-driven metrics, we will describe attributes of the compact models and design environment that allow fast and accurate simulation of small signal and large signal RFSW performance to create the most advanced and highly integrated products.
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