纳米ram的静态和动态写入裕度分析

Jiajing Wang, Satyanand Nalam, B. Calhoun
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引用次数: 200

摘要

本文分析了深度缩放技术中SRAM单元的写入能力,重点讨论了静态和动态写入裕量指标之间的关系。在现代技术中,可靠性已成为SRAM设计的主要关注点。本地不匹配和缩放VDD都会降低读稳定性和写能力。几种静态方法,包括传统的SNM、BL余量和n曲线法,可用于测量静态写余量。然而,静态方法不能表明动态依赖关系对细胞稳定性的影响。我们建议通过将写入操作视为噪声事件来分析动态写入能力,并使用动态稳定性标准进行分析。我们还将动态写入能力定义为写入的临界脉冲宽度。通过使用这个动态标准,我们在正常和缩放的电源电压下评估现有的静态写入余量指标,并评估其局限性。动态写入时间度量也可以用于提高主动VDD缩放设计的VCCmin估计的准确性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Analyzing static and dynamic write margin for nanometer SRAMs
This paper analyzes write ability for SRAM cells in deeply scaled technologies, focusing on the relationship between static and dynamic write margin metrics. Reliability has become a major concern for SRAM designs in modern technologies. Both local mismatch and scaled VDD degrade read stability and write ability. Several static approaches, including traditional SNM, BL margin, and the N-curve method, can be used to measure static write margin. However, static approaches cannot indicate the impact of dynamic dependencies on cell stability. We propose to analyze dynamic write ability by considering the write operation as a noise event that we analyze using dynamic stability criteria. We also define dynamic write ability as the critical pulse width for a write. By using this dynamic criterion, we evaluate the existing static write margin metrics at normal and scaled supply voltages and assess their limitations. The dynamic write time metric can also be used to improve the accuracy of VCCmin estimation for active VDD scaling designs.
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