用cmos芯片测试卡故障和电流测试比较

T. Storey, W. Maly, J. Andrews, M. Miske
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引用次数: 89

摘要

本文比较了卡故障测试和电流测试在CMOS芯片上的有效性。通过使用两种方法开发的模式测试顺序CMOS芯片进行比较,并评估其识别故障产品的能力。然后将测试结果与先前的研究进行对比,在先前的研究中,使用相同的方法测试了一个更小的组合芯片。结果表明,对于所研究的一组芯片,电流测试对某些类别的缺陷提供了更好的缺陷产品筛选,而卡住故障测试对其他类别的缺陷更有效。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
STUCK FAULT AND CURRENT TESTING COMPARISON USING CMOS CHIP TEST
This paper compares the effectiveness of Stuck Fault and Current Testing, as applied to CMOS ICs. The comparison is performed by testing sequential CMOS chips using patterns developed via both methodis, and evaluating their ability to identify faulty prciduct. The test results are then contrasted to a previous study in which a smaller, combinatorial chip was tested by the same means. The results indicate that, for the investigated set of chips, Current Testing provides a better screen of defective product for some classes of defects, while Stuck Fault Testing is more effective on others.
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