{"title":"印刷线路板中导电灯丝的形成","authors":"Bi-Chu Wul, M. Pecht, D. Jennings","doi":"10.1109/IEMT.1992.639865","DOIUrl":null,"url":null,"abstract":"In this paper the preliminary results of a study to characterize the conductive filament formation (often called metal migration) of woven fabric printed wiring boards with respect to resin material, board surface coating, applied bias, geometry of the electrodes and spacing between the electrodes are presented.The experiments were accelerated life tests at controlled temperature-humidity-voltage conditions.","PeriodicalId":403090,"journal":{"name":"Thirteenth IEEE/CHMT International Electronics Manufacturing Technology Symposium","volume":"16 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1992-09-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"15","resultStr":"{\"title\":\"Conductive Filament Formation In Printed Wiring Boards\",\"authors\":\"Bi-Chu Wul, M. Pecht, D. Jennings\",\"doi\":\"10.1109/IEMT.1992.639865\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper the preliminary results of a study to characterize the conductive filament formation (often called metal migration) of woven fabric printed wiring boards with respect to resin material, board surface coating, applied bias, geometry of the electrodes and spacing between the electrodes are presented.The experiments were accelerated life tests at controlled temperature-humidity-voltage conditions.\",\"PeriodicalId\":403090,\"journal\":{\"name\":\"Thirteenth IEEE/CHMT International Electronics Manufacturing Technology Symposium\",\"volume\":\"16 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1992-09-28\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"15\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Thirteenth IEEE/CHMT International Electronics Manufacturing Technology Symposium\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IEMT.1992.639865\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Thirteenth IEEE/CHMT International Electronics Manufacturing Technology Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEMT.1992.639865","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Conductive Filament Formation In Printed Wiring Boards
In this paper the preliminary results of a study to characterize the conductive filament formation (often called metal migration) of woven fabric printed wiring boards with respect to resin material, board surface coating, applied bias, geometry of the electrodes and spacing between the electrodes are presented.The experiments were accelerated life tests at controlled temperature-humidity-voltage conditions.