{"title":"一种采用电容-等平面-位线(CEB)消除位线耦合噪声的新型DRAM单元结构","authors":"Li-Fu Chang, Y. Hsu, M. Chi","doi":"10.1109/ICSICT.1998.785913","DOIUrl":null,"url":null,"abstract":"A new cell structure for minimizing bit-line coupling noise in DRAM with stack capacitor is proposed in this paper. The node capacitors are fabricated in between bit-lines, so that the bit-line to bit-line capacitance coupling is blocked by the node capacitor and is shielded by the plate. This scheme is referred to as Capacitor-Equiplanar-to-Bitline (CEB). In this way, as 3D simulation shows, the bit-line coupling noise can be almost eliminated to <1% of total bit-line capacitance. The SPICE simulation shows /spl sim/3 ns faster bit-line signal sensing in 0.25 /spl mu/m 64 Mb CMOS DRAM. The CEB scheme also leads to a smaller topology and a simpler fabrication process.","PeriodicalId":286980,"journal":{"name":"1998 5th International Conference on Solid-State and Integrated Circuit Technology. Proceedings (Cat. No.98EX105)","volume":"2 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1998-10-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"A new DRAM cell structure with Capacitor-Equiplanar-to-Bitline (CEB) for bitline coupling noise elimination\",\"authors\":\"Li-Fu Chang, Y. Hsu, M. Chi\",\"doi\":\"10.1109/ICSICT.1998.785913\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A new cell structure for minimizing bit-line coupling noise in DRAM with stack capacitor is proposed in this paper. The node capacitors are fabricated in between bit-lines, so that the bit-line to bit-line capacitance coupling is blocked by the node capacitor and is shielded by the plate. This scheme is referred to as Capacitor-Equiplanar-to-Bitline (CEB). In this way, as 3D simulation shows, the bit-line coupling noise can be almost eliminated to <1% of total bit-line capacitance. The SPICE simulation shows /spl sim/3 ns faster bit-line signal sensing in 0.25 /spl mu/m 64 Mb CMOS DRAM. The CEB scheme also leads to a smaller topology and a simpler fabrication process.\",\"PeriodicalId\":286980,\"journal\":{\"name\":\"1998 5th International Conference on Solid-State and Integrated Circuit Technology. Proceedings (Cat. No.98EX105)\",\"volume\":\"2 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1998-10-21\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"1998 5th International Conference on Solid-State and Integrated Circuit Technology. Proceedings (Cat. No.98EX105)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICSICT.1998.785913\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"1998 5th International Conference on Solid-State and Integrated Circuit Technology. Proceedings (Cat. No.98EX105)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICSICT.1998.785913","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A new DRAM cell structure with Capacitor-Equiplanar-to-Bitline (CEB) for bitline coupling noise elimination
A new cell structure for minimizing bit-line coupling noise in DRAM with stack capacitor is proposed in this paper. The node capacitors are fabricated in between bit-lines, so that the bit-line to bit-line capacitance coupling is blocked by the node capacitor and is shielded by the plate. This scheme is referred to as Capacitor-Equiplanar-to-Bitline (CEB). In this way, as 3D simulation shows, the bit-line coupling noise can be almost eliminated to <1% of total bit-line capacitance. The SPICE simulation shows /spl sim/3 ns faster bit-line signal sensing in 0.25 /spl mu/m 64 Mb CMOS DRAM. The CEB scheme also leads to a smaller topology and a simpler fabrication process.