G. Shinh, N. Nakhla, R. Achar, M. Nakhla, A. Dounavis, I. Erdin
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Efficient SPICE macromodel for EMI analysis of electronic packages and high-speed interconnects
This work presents a SPICE macromodel for fast transient analysis of lossy multiconductor transmission line (MTL) interconnects in the presence of electromagnetic interference (EMI). A simplified formulation based on split representation at both ends of the MTL structure for computation of equivalent sources in the time-domain is described. A passive and compact macromodel based on delay extraction and closed-form representation is used to describe the distributed nature of the MTL stamp. The proposed algorithm, while guaranteeing the stability of the simulation by employing passive macromodels, provides significant speed-up for EMI analysis of transmission line networks, especially with large delay and low losses.
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